Findchips: Parametric Search Results for 70V07L25JG8


Select Parts		Part Number

		70V07L25JG8 Renesas Electronics Corporation
		IDT70V07L25JG8 Integrated Device Technology Inc
		70V07L25JG8 Integrated Device Technology Inc

				Most Relevant					Technical														Compliance			Operating Conditions	Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	Part Package Code	Pin Count	ECCN Code	HTS Code

Check for Price

Yes

End Of Life

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

Matte Tin (Sn)

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

RENESAS ELECTRONICS CORP

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

compliant

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

QCCJ,

compliant

LCC

EAR99

8542.32.00.41

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

compliant

LCC

EAR99

8542.32.00.41

Compare

70V07L25JG8

Renesas Electronics Corporation

Check for Price

Yes

End Of Life

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

Matte Tin (Sn)

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

RENESAS ELECTRONICS CORP

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

compliant

IDT70V07L25JG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

QCCJ,

compliant

LCC

EAR99

8542.32.00.41

70V07L25JG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

262.144 kbit

32KX8

3.3 V

25 ns

MULTI-PORT SRAM

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

32000

32.768 k

ASYNCHRONOUS

PARALLEL

3.6 V

3 V

CMOS

COMMERCIAL

S-PQCC-J68

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.572 mm

24.2062 mm

INTEGRATED DEVICE TECHNOLOGY INC

0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68

compliant

LCC

EAR99

8542.32.00.41

Parametric results for: 70V07L25JG8 under SRAMs