Findchips: Parametric Search Results for 70V3599S133BCI8


Select Parts		Part Number

		70V3599S133BCI8 Integrated Device Technology Inc
		70V3599S133BCI8 Renesas Electronics Corporation
		IDT70V3599S133BCI8 Integrated Device Technology Inc

				Most Relevant						Technical																	Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$106.5456

Transferred

4.7186 Mbit

128KX36

3.3 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.15 V

480 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256

256

BC256

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

End Of Life

4.7186 Mbit

128KX36

3.3 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.15 V

480 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

17 mm

RENESAS ELECTRONICS CORP

CABGA

256

BC256

not_compliant

NLR

8542320041

Renesas Electronics

Check for Price

Transferred

4.7186 Mbit

128KX36

3.3 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.15 V

480 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn63Pb37)

BALL

1 mm

BOTTOM

1.7 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

not_compliant

3A991.B.2.A

8542.32.00.41

Compare

70V3599S133BCI8

Integrated Device Technology Inc

$106.5456

Transferred

4.7186 Mbit

128KX36

3.3 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.15 V

480 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256

256

BC256

not_compliant

3A991.B.2.A

8542.32.00.41

70V3599S133BCI8

Renesas Electronics Corporation

Check for Price

End Of Life

4.7186 Mbit

128KX36

3.3 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.15 V

480 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

17 mm

RENESAS ELECTRONICS CORP

CABGA

256

BC256

not_compliant

NLR

8542320041

Renesas Electronics

IDT70V3599S133BCI8

Integrated Device Technology Inc

Check for Price

Transferred

4.7186 Mbit

128KX36

3.3 V

15 ns

133 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.15 V

480 µA

3.45 V

3.15 V

CMOS

INDUSTRIAL

S-PBGA-B256

Not Qualified

85 °C

-40 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn63Pb37)

BALL

1 mm

BOTTOM

1.7 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

not_compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: 70V3599S133BCI8 under SRAMs