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Manufacturer Part Number: 70v7599s166bf
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IDT70V7599S166BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 12 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 208 PLASTIC/EPOXY TFBGA SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
70V7599S166BF8
 Renesas Electronics Corporation 		Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 12 ns 166 MHz DUAL-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 790 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 not_compliant NLR 8542320041 BF208 Renesas Electronics
70V7599S166BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 12 ns 166 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 790 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 not_compliant 3A991.B.2.A 8542.32.00.41 BF208
IDT70V7599S166BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 790 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
70V7599S166BFG
 Integrated Device Technology Inc 		Check for Price Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.6 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 70 °C 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, compliant 3A991.B.2.A 8542.32.00.41
IDT70V7599S166BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 790 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V7599S166BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 12 ns MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 208 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
70V7599S166BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 36 128KX36 3.3 V 12 ns 166 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 790 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 not_compliant 3A991.B.2.A 8542.32.00.41 BF208
70V7599S166BFG8
 Integrated Device Technology Inc 		Check for Price Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.6 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 70 °C 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY YES BALL BOTTOM INTEGRATED DEVICE TECHNOLOGY INC BGA, compliant 3A991.B.2.A 8542.32.00.41
70V7599S166BF
 Renesas Electronics Corporation 		Check for Price No No Obsolete 4.7186 Mbit 36 128KX36 3.3 V 12 ns 166 MHz DUAL-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 790 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 not_compliant NLR 8542320041 BF208 Renesas Electronics