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Manufacturer Part Number: 70t3339s133bfi
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70T3339S133BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70T3339S133BFI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70T3339S133BFI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
70T3339S133BFI8
 Renesas Electronics Corporation 		Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 BF208 not_compliant NLR 8542320041 Renesas Electronics
70T3339S133BFI
 Renesas Electronics Corporation 		Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 BF208 not_compliant NLR 8542320041 Renesas Electronics
IDT70T3339S133BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 2.5 V 15 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 20 mA 2.4 V 450 µA 2.6 V 2.4 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41