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Manufacturer Part Number: 70v3319s133bf
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70V3319S133BF8
 Integrated Device Technology Inc 		$96.8688 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BFI8
 Integrated Device Technology Inc 		$106.5456 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BF
 Integrated Device Technology Inc 		$117.2921 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BFI
 Integrated Device Technology Inc 		$129.0093 No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 208 BF208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-CBGA-B208 Not Qualified e1 3 70 °C 260 30 208 CERAMIC, METAL-SEALED COFIRED LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BF
 Renesas Electronics Corporation 		Check for Price No No End Of Life 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz DUAL-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 BF208 not_compliant NLR 8542320041 Renesas Electronics
IDT70V3319S133BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
IDT70V3319S133BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz MULTI-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.15 V 480 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 not_compliant 3A991.B.2.A 8542.32.00.41
70V3319S133BF8
 Renesas Electronics Corporation 		Check for Price No No End Of Life 4.7186 Mbit 18 256KX18 3.3 V 15 ns 133 MHz DUAL-PORT SRAM PIPELINED OR FLOW-THROUGH ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm RENESAS ELECTRONICS CORP CABGA 208 BF208 not_compliant NLR 8542320041 Renesas Electronics
IDT70V3319S133BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 18 256KX18 3.3 V 4.2 ns 133 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 400 µA 3.45 V 3.15 V CMOS COMMERCIAL S-CBGA-B208 Not Qualified e1 3 70 °C 260 30 208 CERAMIC, METAL-SEALED COFIRED LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC BGA LFBGA, BGA208,17X17,32 208 compliant 3A991.B.2.A 8542.32.00.41
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