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IDT70V3569S4BFGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 36 | 16KX36 | 3.3 V | 4.2 ns | MULTI-PORT SRAM | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | 1 | 16000 | 16.384 k | SYNCHRONOUS | PARALLEL | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | FINE PITCH, BGA-208 | 208 | compliant | 3A991.B.2.B | 8542.32.00.41 | |||||||||||||||
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70V3569S4BFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 36 | 16KX36 | 3.3 V | 4.2 ns | 133 MHz | MULTI-PORT SRAM | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | COMMON | 1 | 2 | 16000 | 16.384 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 460 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | LFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.7 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | 15 X 15 MM, 1.40 MM, 0.80 MM PITCH, GREEN, FPBGA-208 | 208 | compliant | 3A991.B.2.B | 8542.32.00.41 | BFG208 | 1999-01-01 | ||||
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70V3569S4BFG
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 589.824 kbit | 36 | 16KX36 | 3.3 V | 4.2 ns | 133 MHz | MULTI-PORT SRAM | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | COMMON | 1 | 2 | 16000 | 16.384 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 460 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | LFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.7 mm | 15 mm | 15 mm | RENESAS ELECTRONICS CORP | CABGA | 208 | compliant | NLR | 8542320041 | BFG208 | Renesas Electronics | |||||
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70V3569S4BFG8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 589.824 kbit | 36 | 16KX36 | 3.3 V | 4.2 ns | 133 MHz | MULTI-PORT SRAM | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | COMMON | 1 | 2 | 16000 | 16.384 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 460 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | RENESAS ELECTRONICS CORP | CABGA | 208 | compliant | NLR | 8542320041 | BFG208 | Renesas Electronics | |||||
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IDT70V3569S4BFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 36 | 16KX36 | 3.3 V | 4.2 ns | 133 MHz | MULTI-PORT SRAM | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | COMMON | 1 | 2 | 16000 | 16.384 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 460 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | TFBGA, BGA208,17X17,32 | 208 | compliant | 3A991.B.2.B | 8542.32.00.41 | 1999-01-01 | |||||
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IDT70V3569S4BFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 36 | 16KX36 | 3.3 V | 4.2 ns | 133 MHz | MULTI-PORT SRAM | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | COMMON | 1 | 2 | 16000 | 16.384 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 460 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-CBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | CERAMIC, METAL-SEALED COFIRED | LFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.7 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LFBGA, BGA208,17X17,32 | 208 | compliant | 3A991.B.2.B | 8542.32.00.41 | 1999-01-01 | |||||
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70V3569S4BFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 36 | 16KX36 | 3.3 V | 4.2 ns | 133 MHz | MULTI-PORT SRAM | PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE | COMMON | 1 | 2 | 16000 | 16.384 k | SYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 3.15 V | 460 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B208 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 208 | PLASTIC/EPOXY | TFBGA | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 15 mm | 15 mm | INTEGRATED DEVICE TECHNOLOGY INC | CABGA | FINE PITCH, BGA-208 | 208 | compliant | 3A991.B.2.B | 8542.32.00.41 | BFG208 | 1999-01-01 |