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71V3556S133PFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 4.2 ns | 133 MHz | ZBT SRAM | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 45 mA | 3.14 V | 310 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-100 | 100 | PKG100 | compliant | 3A991.B.2.A | 8542.32.00.41 | 1998-08-01 | |||
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IDT71V3556S133PFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 4.2 ns | 133 MHz | ZBT SRAM | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 45 mA | 3.14 V | 310 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP100,.63X.87 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | 1998-08-01 | ||||
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71V3556S133PFGI8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 4.7186 Mbit | 36 | 128KX36 | 3.3 V | 4.2 ns | 133 MHz | ZBT SRAM | COMMON | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | PARALLEL | 45 mA | 3.14 V | 310 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | RENESAS ELECTRONICS CORP | TQFP | 100 | PKG100 | compliant | NLR | 8542320041 | Renesas Electronics |