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Manufacturer Part Number: 71v6560
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71V65603S100PFG8
 Integrated Device Technology Inc 		$6.3788 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V65603S133PFG8
 Integrated Device Technology Inc 		$6.3788 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 4.2 ns 133 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V65603S133PFG
 Integrated Device Technology Inc 		$7.0166 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 4.2 ns 133 MHz ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP PLASTIC, MO-136, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V65603S100PFG
 Integrated Device Technology Inc 		$7.0166 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 5 ns 100 MHz ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 250 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP PLASTIC, MO-136, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V65603S150BQG
 Integrated Device Technology Inc 		$9.3093 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA FBGA-165 165 BQG165 compliant 3A991.B.2.A 8542.32.00.41
71V65603S133BQG
 Integrated Device Technology Inc 		$9.3093 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 4.2 ns 133 MHz ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA FBGA-165 165 BQG165 compliant 3A991.B.2.A 8542.32.00.41
71V65603S150PFG8
 Integrated Device Technology Inc 		$10.5215 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V65603S150PFG
 Integrated Device Technology Inc 		$11.8672 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP PLASTIC, MO-136, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41
71V65603S133BGG8
 Integrated Device Technology Inc 		$14.0191 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 4.2 ns 133 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 300 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, ROHS COMPLIANT, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
71V65603S150BGG8
 Integrated Device Technology Inc 		$14.0191 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, MO-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
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