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Manufacturer Part Number: 71t75602s100bg
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71T75602S100BG8
 Integrated Device Technology Inc 		$21.6878 No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 2.38 V 175 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, MS-028-AA, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41
71T75602S100BGG8
 Integrated Device Technology Inc 		$21.6878 Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 2.38 V 175 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
71T75602S100BGI8
 Integrated Device Technology Inc 		$22.6446 No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, MS-028-AA, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41
71T75602S100BGGI8
 Integrated Device Technology Inc 		$22.6446 Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
71T75602S100BG
 Integrated Device Technology Inc 		$25.5289 No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 2.38 V 175 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, MS-028AA, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41
71T75602S100BGG
 Integrated Device Technology Inc 		$27.2035 Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 2.38 V 175 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, GREEN, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
71T75602S100BGI
 Integrated Device Technology Inc 		$28.4036 No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, MS-028AA, BGA-119 119 BG119 not_compliant 3A991.B.2.A 8542.32.00.41
71T75602S100BGGI
 Integrated Device Technology Inc 		$28.4036 Yes Yes Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 14 X 22 MM, GREEN, MS-028AA, BGA-119 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41
IDT71T75602S100BGI
 Integrated Device Technology Inc 		Check for Price No No Transferred 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn63Pb37) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, BGA119,7X17,50 119 not_compliant 3A991.B.2.A 8542.32.00.41
71T75602S100BGGI8
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 5 ns 100 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 2.38 V 195 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm RENESAS ELECTRONICS CORP PBGA 119 BGG119 compliant NLR 8542320041 Renesas Electronics
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