Findchips: Parametric Search Results for 71v2559

Parametric results for: 71v2559 under SRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		71V2559S75BQ8 Integrated Device Technology Inc
		71V2559SA80BQGI Integrated Device Technology Inc
		71V2559S80BQ Integrated Device Technology Inc
		71V2559SA85BQ Integrated Device Technology Inc
		IDT71V2559S80BGI Integrated Device Technology Inc
		71V2559S80PF8 Integrated Device Technology Inc
		71V2559S85PFI8 Integrated Device Technology Inc
		IDT71V2559SA80BQI Integrated Device Technology Inc
		71V2559S75BG Integrated Device Technology Inc
		71V2559S65BG8 Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

7.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

70 °C

225

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

TBGA,

165

BQ165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

13 X 15 MM, FBGA-165

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

TBGA, BGA165,11X15,40

165

BQ165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8.5 ns

90 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

225 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

TBGA, BGA165,11X15,40

165

BQ165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

14 X 22 MM, PLASTIC, BGA-119

119

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

LQFP, QFP100,.63X.87

100

PK100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8.5 ns

90 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

235 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

LQFP, QFP100,.63X.87

100

PK100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

13 X 15 MM, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

7.5 ns

100 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

275 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

PBGA

BGA, BGA119,7X17,50

119

BG119

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

ZBT SRAM

225

TIN LEAD

INTEGRATED DEVICE TECHNOLOGY INC

PBGA

119

BG119

not_compliant

EAR99

8542.32.00.41

1 2 3 4 5 Next

Compare

71V2559S75BQ8

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

7.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

70 °C

225

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

TBGA,

165

BQ165

not_compliant

3A991.B.2.A

8542.32.00.41

71V2559SA80BQGI

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

13 X 15 MM, FBGA-165

165

compliant

3A991.B.2.A

8542.32.00.41

71V2559S80BQ

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

TBGA, BGA165,11X15,40

165

BQ165

not_compliant

3A991.B.2.A

8542.32.00.41

71V2559SA85BQ

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8.5 ns

90 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

225 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

TBGA, BGA165,11X15,40

165

BQ165

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V2559S80BGI

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

14 X 22 MM, PLASTIC, BGA-119

119

not_compliant

3A991.B.2.A

8542.32.00.41

71V2559S80PF8

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

LQFP, QFP100,.63X.87

100

PK100

not_compliant

3A991.B.2.A

8542.32.00.41

71V2559S85PFI8

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8.5 ns

90 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

235 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

LQFP, QFP100,.63X.87

100

PK100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V2559SA80BQI

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

13 X 15 MM, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

71V2559S75BG

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

7.5 ns

100 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

275 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

PBGA

BGA, BGA119,7X17,50

119

BG119

not_compliant

3A991.B.2.A

8542.32.00.41

71V2559S65BG8

Integrated Device Technology Inc

Check for Price

Obsolete

ZBT SRAM

225

TIN LEAD

INTEGRATED DEVICE TECHNOLOGY INC

PBGA

119

BG119

not_compliant

EAR99

8542.32.00.41

1 2 3 4 5 Next