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Manufacturer Part Number: 71v3556sa166bggi
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71V3556SA166BGGI8
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz ZBT SRAM COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm RENESAS ELECTRONICS CORP PBGA 119 BGG119 compliant NLR 8542320041 Renesas Electronics
IDT71V3556SA166BGGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz ZBT SRAM COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 119 compliant 3A991.B.2.A 8542.32.00.41 BGA, BGA119,7X17,50 1998-08-01
71V3556SA166BGGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz ZBT SRAM COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41 14 X 22 MM, ROHS COMPLIANT, PLASTIC, MS-028AA, BGA-119 1998-08-01
IDT71V3556SA166BGGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz ZBT SRAM COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 119 compliant 3A991.B.2.A 8542.32.00.41 BGA, BGA119,7X17,50 1998-08-01
71V3556SA166BGGI
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz ZBT SRAM COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm RENESAS ELECTRONICS CORP PBGA 119 BGG119 compliant NLR 8542320041 Renesas Electronics
71V3556SA166BGGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.5 ns 166 MHz ZBT SRAM COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 45 mA 3.14 V 360 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 30 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC PBGA 119 BGG119 compliant 3A991.B.2.A 8542.32.00.41 14 X 22 MM, ROHS COMPLIANT, PLASTIC, MS-028AA, BGA-119 1998-08-01