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71V3559S75PFG8
Integrated Device Technology Inc
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$3.9988 | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 7.5 ns | 100 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 275 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-100 | 100 | PKG100 | compliant | 3A991.B.2.A | 8542.32.00.41 | 1998-08-01 | ||||
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71V3559S75PFG
Integrated Device Technology Inc
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$4.4717 | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 7.5 ns | 100 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECHTURE | 18 | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 275 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 14 X 20 MM, PLASTIC, TQFP-100 | 100 | PKG100 | compliant | 3A991.B.2.A | 8542.32.00.41 | 1998-08-01 | |||
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71V3559S75PFGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | CACHE SRAM | e3 | 3 | 260 | TIN | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 100 | PKG100 | compliant | EAR99 | 8542.32.00.41 | ||||||||||||||||||||||||||||||||||||||||||||
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IDT71V3559S75PFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 7.5 ns | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||
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71V3559S75PFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | CACHE SRAM | e3 | 3 | 260 | TIN | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 100 | PKG100 | compliant | EAR99 | 8542.32.00.41 | ||||||||||||||||||||||||||||||||||||||||||||
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71V3559S75PFG8
Renesas Electronics Corporation
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Check for Price | Yes | Yes | End Of Life | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 7.5 ns | 100 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 275 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | RENESAS ELECTRONICS CORP | TQFP | 14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-100 | 100 | PKG100 | compliant | NLR | 8542320041 | Renesas Electronics | ||||
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IDT71V3559S75PFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 7.5 ns | 100 MHz | CACHE SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 275 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, QFP100,.63X.87 | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | 1998-08-01 | |||||
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71V3559S75PFG
Renesas Electronics Corporation
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Check for Price | Yes | Yes | End Of Life | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 7.5 ns | 100 MHz | ZBT SRAM | FLOW-THROUGH ARCHITECHTURE | 18 | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 275 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | RENESAS ELECTRONICS CORP | TQFP | 100 | PKG100 | compliant | NLR | 8542320041 | Renesas Electronics |