Findchips: Parametric Search Results for 71v3577

Parametric results for: 71v3577 under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		71V3577S85PFG8 Integrated Device Technology Inc
		71V3577S80PFG8 Integrated Device Technology Inc
		71V3577S65PFG8 Integrated Device Technology Inc
		71V3577S80PFG Integrated Device Technology Inc
		71V3577S75PFG Integrated Device Technology Inc
		71V3577S85PFG Integrated Device Technology Inc
		71V3577S65PFG Integrated Device Technology Inc
		71V3577S75PFG8 Integrated Device Technology Inc
		71V3577S75PFGI8 Integrated Device Technology Inc
		71V3577S65PFGI8 Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

$3.8083

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8.5 ns

87 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

180 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$3.8355

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8 ns

100 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

200 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$4.0281

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

6.5 ns

CACHE SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

70 °C

260

100

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

YES

TIN

GULL WING

QUAD

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$4.2041

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8 ns

100 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

200 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

QFP

QFP100,.63X.87

RECTANGULAR

FLATPACK

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$4.2588

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

7.5 ns

117 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

255 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

QFP

QFP100,.63X.87

RECTANGULAR

FLATPACK

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$4.2588

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8.5 ns

87 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

180 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

QFP

QFP100,.63X.87

RECTANGULAR

FLATPACK

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$4.5045

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

6.5 ns

CACHE SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

70 °C

260

100

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

YES

TIN

GULL WING

QUAD

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$4.5330

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

7.5 ns

117 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

255 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$4.7604

Yes

Transferred

260

TIN

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

$4.7604

Yes

Transferred

CACHE SRAM

260

TIN

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next

Compare

71V3577S85PFG8

Integrated Device Technology Inc

$3.8083

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8.5 ns

87 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

180 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S80PFG8

Integrated Device Technology Inc

$3.8355

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8 ns

100 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

200 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S65PFG8

Integrated Device Technology Inc

$4.0281

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

6.5 ns

CACHE SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

70 °C

260

100

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

YES

TIN

GULL WING

QUAD

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S80PFG

Integrated Device Technology Inc

$4.2041

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8 ns

100 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

200 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

QFP

QFP100,.63X.87

RECTANGULAR

FLATPACK

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S75PFG

Integrated Device Technology Inc

$4.2588

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

7.5 ns

117 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

255 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

QFP

QFP100,.63X.87

RECTANGULAR

FLATPACK

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S85PFG

Integrated Device Technology Inc

$4.2588

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8.5 ns

87 MHz

CACHE SRAM

FLOW THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

180 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

QFP

QFP100,.63X.87

RECTANGULAR

FLATPACK

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S65PFG

Integrated Device Technology Inc

$4.5045

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

6.5 ns

CACHE SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

70 °C

260

100

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

YES

TIN

GULL WING

QUAD

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S75PFG8

Integrated Device Technology Inc

$4.5330

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

7.5 ns

117 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

255 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

260

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

MATTE TIN

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

14 X 20 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S75PFGI8

Integrated Device Technology Inc

$4.7604

Yes

Transferred

260

TIN

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1997-09-16

71V3577S65PFGI8

Integrated Device Technology Inc

$4.7604

Yes

Transferred

CACHE SRAM

260

TIN

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

100

PKG100

compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next