Parametric results for: 71v65603s150bqg under SRAMs

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Manufacturer Part Number: 71v65603s150bqg
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IDT71V65603S150BQGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 3.14 V 345 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, BGA165,11X15,40 165 compliant 3A991.B.2.A 8542.32.00.41
71V65603S150BQGI8
Renesas Electronics Corporation
Check for Price Yes Yes Active 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 3.14 V 345 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm RENESAS ELECTRONICS CORP CABGA 165 compliant NLR 8542320041 BQG165 Renesas Electronics
71V65603S150BQGI
Renesas Electronics Corporation
Check for Price Yes Yes Active 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 3.14 V 345 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm RENESAS ELECTRONICS CORP CABGA 165 compliant NLR 8542320041 BQG165 Renesas Electronics
71V65603S150BQGI8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 3.14 V 345 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 13 X 15 MM, ROHS COMPLIANT, BGA-165 165 compliant 3A991.B.2.A 8542.32.00.41 BQG165
71V65603S150BQG
Renesas Electronics Corporation
Check for Price Yes Yes Obsolete 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm RENESAS ELECTRONICS CORP CABGA 165 compliant NLR 8542320041 BQG165 Renesas Electronics
71V65603S150BQG8
Renesas Electronics Corporation
Check for Price Yes Yes Obsolete 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm RENESAS ELECTRONICS CORP CABGA 165 compliant NLR 8542320041 BQG165 Renesas Electronics
71V65603S150BQG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 13 X 15 MM, ROHS COMPLIANT, FBGA-165 165 compliant 3A991.B.2.A 8542.32.00.41 BQG165
71V65603S150BQG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA FBGA-165 165 compliant 3A991.B.2.A 8542.32.00.41 BQG165
71V65603S150BQGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 60 mA 3.14 V 345 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 13 X 15 MM, BGA-165 165 compliant 3A991.B.2.A 8542.32.00.41 BQG165
IDT71V65603S150BQG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns ZBT SRAM BURST COUNTER COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 40 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, BGA165,11X15,40 165 compliant 3A991.B.2.A 8542.32.00.41