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Manufacturer Part Number: 71v67803s133bq
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IDT71V67803S133BQGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns CACHE SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, 165 compliant 3A991.B.2.A 8542.32.00.41
71V67803S133BQG
 Rochester Electronics LLC 		Check for Price Yes Yes Active 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns STANDARD SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 COMMERCIAL e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm ROCHESTER ELECTRONICS LLC BGA 13 X 15 MM, ROHS COMPLIANT, BGA-165 165 unknown
IDT71V67803S133BQ
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns 133 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, BGA165,11X15,40 165 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V67803S133BQI
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns 133 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 280 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 13 X 15 MM, FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16 BQ165
71V67803S133BQ
 Renesas Electronics Corporation 		Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns 133 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm RENESAS ELECTRONICS CORP CABGA 165 not_compliant NLR 8542320041 BQ165 Renesas Electronics
71V67803S133BQG
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns 133 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm RENESAS ELECTRONICS CORP CABGA 165 compliant NLR 8542320041 BQG165 Renesas Electronics
71V67803S133BQ
 Integrated Device Technology Inc 		Check for Price No No Transferred 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns 133 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 13 X 15 MM, FBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41 1997-09-16 BQ165
71V67803S133BQG8
 Renesas Electronics Corporation 		Check for Price Yes Yes Obsolete 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns 133 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm RENESAS ELECTRONICS CORP CABGA 165 compliant NLR 8542320041 BQG165 Renesas Electronics
71V67803S133BQGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns 133 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 280 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 13 X 15 MM, ROHS COMPLIANT, BGA-165 165 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16 BQG165
71V67803S133BQG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 18 512KX18 3.3 V 4.2 ns 133 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 260 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e1 3 70 °C 260 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 13 X 15 MM, ROHS COMPLIANT, BGA-165 165 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16 BQG165
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