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7205L50JG8
Integrated Device Technology Inc
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Check for Price | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 65 ns | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | LCC-32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||||
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IDT7205L50J8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 15 MHz | 65 ns | OTHER FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 8 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | PLASTIC, LCC-32 | not_compliant | EAR99 | 8542.32.00.71 | QFJ | 32 | |||||
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IDT7205L50JG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 65 ns | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QCCJ, | compliant | EAR99 | 8542.32.00.71 | QFJ | 32 | |||||||||||||
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7205L50J
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 15 MHz | 65 ns | OTHER FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 8 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | PLASTIC, LCC-32 | not_compliant | EAR99 | 8542.32.00.71 | PLCC | 32 | PL32 | |||||
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7205L50JG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 65 ns | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | GREEN, PLASTIC, LCC-32 | compliant | EAR99 | 8542.32.00.71 | QFJ | 32 | |||||||||||
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7205L50JI
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 65 ns | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | e0 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QCCJ, | compliant | EAR99 | 8542.32.00.71 | QFJ | 32 | |||||||||||||||
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7205L50J8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 15 MHz | 65 ns | OTHER FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 8 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | PLASTIC, LCC-32 | not_compliant | EAR99 | 8542.32.00.71 | PLCC | 32 | PL32 | |||||
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IDT7205L50J
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 15 MHz | 65 ns | OTHER FIFO | RETRANSMIT | 1 | 8000 | 8.192 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 8 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | PLASTIC, LCC-32 | not_compliant | EAR99 | 8542.32.00.71 | QFJ | 32 | |||||
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7205L50JB
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 73.728 kbit | 9 | 8KX9 | 5 V | 50 ns | 65 ns | 1 | 8000 | 8.192 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-PQCC-J32 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QCCJ, | compliant | EAR99 | 8542.32.00.71 | QFJ | 32 |