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Manufacturer Part Number: 72v03l25j
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72V03L25JGI8
 Integrated Device Technology Inc 		$7.8288 Yes Yes Transferred 18.432 kbit 9 2KX9 3.3 V 25 ns 35 ns 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC LCC-32 32 PLG32 compliant EAR99 8542.32.00.71 1988-01-01
72V03L25JGI
 Integrated Device Technology Inc 		$9.5159 Yes Yes Transferred 18.432 kbit 9 2KX9 3.3 V 25 ns 35 ns RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC LCC-32 32 PLG32 compliant EAR99 8542.32.00.71 1988-01-01
72V03L25J
 Integrated Device Technology Inc 		Check for Price No No Obsolete 18.432 kbit 9 2KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 300 µA 50 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC PLASTIC, LCC-32 32 PL32 not_compliant EAR99 8542.32.00.71
72V03L25JGI
 Renesas Electronics Corporation 		Check for Price Yes Yes Active 18.432 kbit 9 2KX9 3.3 V 25 ns 35 ns OTHER FIFO RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 1 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm RENESAS ELECTRONICS CORP PLCC 32 PLG32 compliant NLR 8542320071 Renesas Electronics
IDT72V03L25JGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 18.432 kbit 9 2KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71 1988-01-01
72V03L25JI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 18.432 kbit 9 2KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 300 µA 50 µA 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC PLASTIC, LCC-32 32 PL32 not_compliant EAR99 8542.32.00.71
IDT72V03L25JI8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 18.432 kbit 9 2KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 300 µA 50 µA 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
72V03L25JGI8
 Renesas Electronics Corporation 		Check for Price Yes Yes End Of Life 18.432 kbit 9 2KX9 3.3 V 25 ns 35 ns OTHER FIFO 1 2000 2.048 k ASYNCHRONOUS NO PARALLEL 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 1 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm RENESAS ELECTRONICS CORP PLCC 32 PLG32 compliant NLR 8542320071 Renesas Electronics
IDT72V03L25JGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 18.432 kbit 9 2KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71 1988-01-01
IDT72V03L25JG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 18.432 kbit 9 2KX9 3.3 V 25 ns 35 ns RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 70 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
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