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Parametric » Memory » FIFOs

Parametric results for: 72v235l15tfgi8 under FIFOs

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Select Parts		Part Number

		72V235L15TFGI8 Integrated Device Technology Inc
		IDT72V235L15TFGI8 Integrated Device Technology Inc
		72V235L15TFGI8 Renesas Electronics Corporation

				Most Relevant						Technical											Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Cycle Time	Memory IC Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Enable	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Samacsys Manufacturer

Yes

Yes

Transferred

36.864 kbit

18

2KX18

3.3 V

10 ns

15 ns

1

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQFP-G64

e3

3

85 °C

-40 °C

260

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

TIN

GULL WING

500 µm

QUAD

1.6 mm

10 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

STQFP-64

64

PPG64

compliant

EAR99

8542.32.00.71

1992-01-01

Check for Price

Yes

Yes

Transferred

36.864 kbit

18

2KX18

3.3 V

10 ns

15 ns

1

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQFP-G64

Not Qualified

e3

85 °C

-40 °C

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

MATTE TIN

GULL WING

500 µm

QUAD

1.6 mm

10 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

64

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Yes

End Of Life

36.864 kbit

18

2KX18

3.3 V

10 ns

15 ns

OTHER FIFO

1

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQFP-G64

e3

3

85 °C

-40 °C

260

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

MATTE TIN

GULL WING

500 µm

QUAD

1.6 mm

10 mm

10 mm

RENESAS ELECTRONICS CORP

TQFP

64

PPG64

compliant

NLR

8542320071

Renesas Electronics

Compare

Integrated Device Technology Inc

Yes

Yes

Transferred

36.864 kbit

18

2KX18

3.3 V

10 ns

15 ns

1

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQFP-G64

e3

3

85 °C

-40 °C

260

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

TIN

GULL WING

500 µm

QUAD

1.6 mm

10 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

TQFP

STQFP-64

64

PPG64

compliant

EAR99

8542.32.00.71

1992-01-01

IDT72V235L15TFGI8

Integrated Device Technology Inc

Check for Price

Yes

Yes

Transferred

36.864 kbit

18

2KX18

3.3 V

10 ns

15 ns

1

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQFP-G64

Not Qualified

e3

85 °C

-40 °C

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

MATTE TIN

GULL WING

500 µm

QUAD

1.6 mm

10 mm

10 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

64

compliant

EAR99

8542.32.00.71

Renesas Electronics Corporation

Check for Price

Yes

Yes

End Of Life

36.864 kbit

18

2KX18

3.3 V

10 ns

15 ns

OTHER FIFO

1

2000

2.048 k

SYNCHRONOUS

YES

PARALLEL

3.6 V

3 V

CMOS

INDUSTRIAL

S-PQFP-G64

e3

3

85 °C

-40 °C

260

64

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

MATTE TIN

GULL WING

500 µm

QUAD

1.6 mm

10 mm

10 mm

RENESAS ELECTRONICS CORP

TQFP

64

PPG64

compliant

NLR

8542320071

Renesas Electronics