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CY7C1425KV18-250BZCT
Cypress Semiconductor
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$33.9948 | No | Transferred | 37.7487 Mbit | 9 | 4MX9 | 1.8 V | 450 ps | 250 MHz | STANDARD SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 590 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||
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CY7C1420KV18-250BZCT
Cypress Semiconductor
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$33.9948 | No | No | Transferred | 37.7487 Mbit | 36 | 1MX36 | 1.8 V | 450 ps | 250 MHz | STANDARD SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 490 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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CY7C1426KV18-250BZCT
Cypress Semiconductor
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$33.9948 | No | Transferred | 37.7487 Mbit | 9 | 4MX9 | 450 ps | 250 MHz | STANDARD SRAM | SEPARATE | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 460 µA | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 165 | PLASTIC/EPOXY | BGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||||
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CY7C1424KV18-250BZCT
Cypress Semiconductor
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$33.9948 | No | No | Obsolete | 37.7487 Mbit | 36 | 1MX36 | 1.8 V | 450 ps | 250 MHz | STANDARD SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 490 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 235 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||
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CY7C1426KV18-250BZC
Cypress Semiconductor
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$36.3889 | No | Transferred | 37.7487 Mbit | 9 | 4MX9 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 460 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | FBGA-165 | compliant | 3A991 | 8542.32.00.41 | BGA | 165 | |||||
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CY7C1420KV18-250BZC
Cypress Semiconductor
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$36.3889 | No | Transferred | 37.7487 Mbit | 36 | 1MX36 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 490 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 165 | ||||
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CY7C1425KV18-250BZXC
Cypress Semiconductor
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$36.3889 | Yes | Transferred | 37.7487 Mbit | 9 | 4MX9 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 590 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 165 | ||||
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CY7C1420KV18-250BZXC
Cypress Semiconductor
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$36.3889 | Yes | Transferred | 37.7487 Mbit | 36 | 1MX36 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 490 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 165 | ||||
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CY7C1420KV18-250BZXI
Cypress Semiconductor
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$36.3889 | Yes | Transferred | 37.7487 Mbit | 36 | 1MX36 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 490 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 165 | |||
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CY7C1423KV18-250BZC
Cypress Semiconductor
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$36.3889 | No | Transferred | 37.7487 Mbit | 18 | 2MX18 | 1.8 V | 450 ps | 250 MHz | DDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 260 mA | 1.7 V | 430 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | 3A991.B.2.A | 8542.32.00.41 | BGA | 165 |