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Parametric » Memory » OTP ROMs

Parametric results for: 8200902JA under OTP ROMs

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Select Parts		Part Number

		8200902JA QP Semiconductor
		8200902JA NXP Semiconductors
		5962-8200902JA NXP Semiconductors
		8200902JA AMD

		Most Relevant					Technical												Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

16.384 kbit

4

4KX4

5 V

55 ns

OTP ROM

1

4000

8.192 k

ASYNCHRONOUS

PARALLEL

190 µA

BIPOLAR

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

32.0675 mm

15.24 mm

QP SEMICONDUCTOR INC

DIP

DIP,

24

unknown

EAR99

8542.32.00.71

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Obsolete

1.024 kbit

4

256X4

5 V

55 ns

OTP ROM

1

256

8.192 k

ASYNCHRONOUS

PARALLEL

190 µA

BIPOLAR

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

MIL-STD-883

24

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

DUAL

NXP SEMICONDUCTORS

DIP

DIP,

24

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

65.536 kbit

8

8KX8

5 V

55 ns

OTP ROM

1

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-GDIP-T24

Not Qualified

e0

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

15.24 mm

NXP SEMICONDUCTORS

DIP

DIP,

24

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

65.536 kbit

8

8KX8

5 V

55 ns

OTP ROM

1

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

32.0675 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

DIP,

24

unknown

EAR99

8542.32.00.71

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QP Semiconductor

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Obsolete

16.384 kbit

4

4KX4

5 V

55 ns

OTP ROM

1

4000

8.192 k

ASYNCHRONOUS

PARALLEL

190 µA

BIPOLAR

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

32.0675 mm

15.24 mm

QP SEMICONDUCTOR INC

DIP

DIP,

24

unknown

EAR99

8542.32.00.71

NXP Semiconductors

Check for Price

Obsolete

1.024 kbit

4

256X4

5 V

55 ns

OTP ROM

1

256

8.192 k

ASYNCHRONOUS

PARALLEL

190 µA

BIPOLAR

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

MIL-STD-883

24

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

DUAL

NXP SEMICONDUCTORS

DIP

DIP,

24

unknown

EAR99

8542.32.00.71

NXP Semiconductors

Check for Price

Obsolete

65.536 kbit

8

8KX8

5 V

55 ns

OTP ROM

1

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-GDIP-T24

Not Qualified

e0

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

15.24 mm

NXP SEMICONDUCTORS

DIP

DIP,

24

unknown

EAR99

8542.32.00.71

AMD

Check for Price

Obsolete

65.536 kbit

8

8KX8

5 V

55 ns

OTP ROM

1

8000

8.192 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-GDIP-T24

Not Qualified

125 °C

-55 °C

24

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

2.54 mm

DUAL

5.715 mm

32.0675 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

DIP,

24

unknown

EAR99

8542.32.00.71