Findchips.com

Register or Sign In

Parametric » Memory » OTP ROMs

Parametric results for: 82s123b/bea under OTP ROMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		82S123B/BEA NXP Semiconductors
		82S123B/BEA e2v technologies
		82S123B/BEA YAGEO Corporation
		82S123B/BEA Philips Semiconductors

			Most Relevant					Technical											Compliance			Operating Conditions			Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

256 bit

8

32X8

5 V

30 ns

OTP ROM

1

32

32 words

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-GDIP-T16

Not Qualified

125 °C

-55 °C

16

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

19.535 mm

7.62 mm

NXP SEMICONDUCTORS

DIP

DIP,

16

unknown

EAR99

8542.32.00.71

Check for Price

Active

TELEDYNE E2V (UK) LTD

,

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

256 bit

8

32X8

5 V

30 ns

OTP ROM

1

32

32 words

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-CDIP-T16

Not Qualified

125 °C

-55 °C

16

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

DUAL

PHILIPS COMPONENTS

,

unknown

EAR99

8542.32.00.71

Check for Price

No

Transferred

8

32X8

5 V

OTP ROM

32

32 words

TTL

MILITARY

R-XDIP-T16

Not Qualified

e0

125 °C

-55 °C

38535Q/M;38534H;883B

16

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

NO

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

PHILIPS SEMICONDUCTORS

DIP, DIP16,.3

unknown

EAR99

8542.32.00.71

Compare

NXP Semiconductors

Check for Price

Obsolete

256 bit

8

32X8

5 V

30 ns

OTP ROM

1

32

32 words

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-GDIP-T16

Not Qualified

125 °C

-55 °C

16

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

19.535 mm

7.62 mm

NXP SEMICONDUCTORS

DIP

DIP,

16

unknown

EAR99

8542.32.00.71

e2v technologies

Check for Price

Active

TELEDYNE E2V (UK) LTD

,

compliant

EAR99

8542.32.00.71

YAGEO Corporation

Check for Price

Obsolete

256 bit

8

32X8

5 V

30 ns

OTP ROM

1

32

32 words

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

BIPOLAR

MILITARY

R-CDIP-T16

Not Qualified

125 °C

-55 °C

16

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

NO

THROUGH-HOLE

DUAL

PHILIPS COMPONENTS

,

unknown

EAR99

8542.32.00.71

Philips Semiconductors

Check for Price

No

Transferred

8

32X8

5 V

OTP ROM

32

32 words

TTL

MILITARY

R-XDIP-T16

Not Qualified

e0

125 °C

-55 °C

38535Q/M;38534H;883B

16

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

NO

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

PHILIPS SEMICONDUCTORS

DIP, DIP16,.3

unknown

EAR99

8542.32.00.71