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Manufacturer Part Number: 93aa56b
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93AA56BT-I/OT
 Microchip Technology Inc 		$0.2827 Yes Yes Active 2.048 kbit 16 128X16 5 V 1 MHz EEPROM 200 1000000 Write/Erase Cycles 1 1 128 128 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 6 ms SOFTWARE R-PDSO-G6 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 6 PLASTIC/EPOXY LSSOP TSOP5/6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 950 µm DUAL 1.45 mm 2.9 mm 1.55 mm MICROCHIP TECHNOLOGY INC SOT-23 ROHS COMPLIANT, PLASTIC, SOT-23, 6 PIN 6 compliant EAR99 8542.32.00.51 Microchip
93AA56B-I/SN
 Microchip Technology Inc 		$0.3210 Yes Yes Active 2.048 kbit 16 128X16 5 V 1 MHz EEPROM 200 1000000 Write/Erase Cycles 1 1 128 128 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 6 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 8 compliant EAR99 8542.32.00.51 Microchip
93AA56BT-I/SN
 Microchip Technology Inc 		$0.3470 Yes Yes Active 2.048 kbit 16 128X16 5 V 1 MHz EEPROM 200 1000000 Write/Erase Cycles 1 1 128 128 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 6 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 8 compliant EAR99 8542.32.00.51 Microchip
93AA56BX-I/SN
 Microchip Technology Inc 		$0.3470 Yes Yes Active 2.048 kbit 16 128X16 2.5 V 1 MHz EEPROM 200 1000000 Write/Erase Cycles 1 1 128 128 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 6 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 8 compliant EAR99 8542.32.00.51
93AA56BXT-I/SN
 Microchip Technology Inc 		$0.3470 Yes Yes Active 2.048 kbit 16 128X16 2.5 V 1 MHz EEPROM 200 1000000 Write/Erase Cycles 1 1 128 128 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 6 ms SOFTWARE R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 8 compliant EAR99 8542.32.00.51
93AA56BT-I/MC
 Microchip Technology Inc 		$0.4444 Yes Yes Active 2.048 kbit 16 128X16 5 V 1 MHz EEPROM 200 1000000 Write/Erase Cycles 1 1 128 128 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 6 ms SOFTWARE R-PDSO-N8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY HVSON SOLCC8,.11,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) NO LEAD 500 µm DUAL 1 mm 3 mm 2 mm MICROCHIP TECHNOLOGY INC DFN 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 8 compliant EAR99 8542.32.00.51 Microchip
93AA56B-I/P
 Microchip Technology Inc 		$0.6124 Yes Yes Active 2.048 kbit 16 128X16 5 V 1 MHz EEPROM 200 1000000 Write/Erase Cycles 1 1 128 128 words SYNCHRONOUS TOTEM POLE SERIAL YES NO MICROWIRE 1 µA 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL YES 6 ms SOFTWARE R-PDIP-T8 Not Qualified e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.271 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 8 compliant EAR99 8542.32.00.51 Microchip
93AA56BT-E/OT
 Microchip Technology Inc 		Check for Price Yes Yes Active 2.048 kbit 16 128X16 2.5 V 3 MHz EEPROM 8 1 128 128 words SYNCHRONOUS SERIAL MICROWIRE 3 µA 5.5 V 1.8 V CMOS INDUSTRIAL 6 ms R-PDSO-G6 Not Qualified e3 1 85 °C -40 °C 260 40 6 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 950 µm DUAL 1.45 mm 2.95 mm 1.63 mm MICROCHIP TECHNOLOGY INC SOT-23 ROHS COMPLIANT, PLASTIC, SC-74A, SOT-23, 6 PIN 6 compliant EAR99 8542.32.00.51
93AA56BXT-E/P
 Microchip Technology Inc 		Check for Price Yes Yes Active 2.048 kbit 16 128X16 2.5 V 3 MHz EEPROM 8 1 128 128 words SYNCHRONOUS SERIAL MICROWIRE 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL 6 ms R-PDIP-T8 Not Qualified e3 85 °C -40 °C 8 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 4.32 mm 9.46 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8 8 compliant EAR99 8542.32.00.51
93AA56BX-E/MS
 Microchip Technology Inc 		Check for Price Yes Yes Active 2.048 kbit 8 256X8 2.5 V 3 MHz EEPROM 8 1 256 256 words SYNCHRONOUS SERIAL MICROWIRE 2 µA 5.5 V 1.8 V CMOS INDUSTRIAL 6 ms S-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 8 PLASTIC/EPOXY TSSOP SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 3 mm 3 mm MICROCHIP TECHNOLOGY INC TSSOP PLASTIC, MO-187, MSOP-8 8 compliant EAR99 8542.32.00.51
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