Findchips: Parametric Search Results for 93C46AT-I/MC


Select Parts		Part Number

		93C46AT-I/MC Microchip Technology Inc
		93C46A-TI/MCGX Microchip Technology Inc
		93C46AT-I/MCX Microchip Technology Inc
		93C46AT-I/MCG Microchip Technology Inc
		93C46A-TI/MC Microchip Technology Inc
		93C46A-TI/MCG Microchip Technology Inc
		93C46AT-I/MCGX Microchip Technology Inc
		93C46A-TI/MCX Microchip Technology Inc

				Most Relevant					Technical																					Compliance			Operating Conditions						Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Data Retention Time-Min	Endurance	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Ready/Busy	Reverse Pinout	Serial Bus Type	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Write Cycle Time-Max (tWC)	Write Protection	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	Samacsys Manufacturer	ECCN Code	HTS Code

$0.3339

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

200

1000000 Write/Erase Cycles

128

128 words

SYNCHRONOUS

TOTEM POLE

SERIAL

YES

MICROWIRE

1 µA

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

260

TS 16949

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

DFN

HVSON, SOLCC8,.11,20

compliant

Microchip

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

SON

HVSON,

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

6 ms

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

DFN

VSON,

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

200

1000000 Write/Erase Cycles

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

1 µA

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

HVSON, SOLCC8,.11,20

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

200

1000000 Write/Erase Cycles

128

128 words

SYNCHRONOUS

TOTEM POLE

SERIAL

YES

MICROWIRE

1 µA

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

260

TS 16949

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

SON

HVSON, SOLCC8,.11,20

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

200

1000000 Write/Erase Cycles

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

1 µA

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

SON

HVSON, SOLCC8,.11,20

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

HVSON,

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

R-PDSO-N8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

MATTE TIN

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

SON

HVSON,

compliant

Compare

93C46AT-I/MC

Microchip Technology Inc

$0.3339

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

200

1000000 Write/Erase Cycles

128

128 words

SYNCHRONOUS

TOTEM POLE

SERIAL

YES

MICROWIRE

1 µA

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

260

TS 16949

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

DFN

HVSON, SOLCC8,.11,20

compliant

Microchip

93C46A-TI/MCGX

Microchip Technology Inc

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

SON

HVSON,

compliant

EAR99

8542.32.00.51

93C46AT-I/MCX

Microchip Technology Inc

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

6 ms

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VSON

RECTANGULAR

SMALL OUTLINE, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

DFN

VSON,

compliant

EAR99

8542.32.00.51

93C46AT-I/MCG

Microchip Technology Inc

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

200

1000000 Write/Erase Cycles

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

1 µA

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

HVSON, SOLCC8,.11,20

compliant

EAR99

8542.32.00.51

93C46A-TI/MC

Microchip Technology Inc

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

200

1000000 Write/Erase Cycles

128

128 words

SYNCHRONOUS

TOTEM POLE

SERIAL

YES

MICROWIRE

1 µA

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

260

TS 16949

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

SON

HVSON, SOLCC8,.11,20

compliant

EAR99

8542.32.00.51

93C46A-TI/MCG

Microchip Technology Inc

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

200

1000000 Write/Erase Cycles

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

1 µA

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

SOFTWARE

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

SON

HVSON, SOLCC8,.11,20

compliant

EAR99

8542.32.00.51

93C46AT-I/MCGX

Microchip Technology Inc

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

2 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

R-PDSO-N8

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

Matte Tin (Sn)

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

HVSON,

compliant

EAR99

8542.32.00.51

93C46A-TI/MCX

Microchip Technology Inc

Check for Price

Yes

Active

1.024 kbit

128X8

5 V

3 MHz

EEPROM

128

128 words

SYNCHRONOUS

SERIAL

MICROWIRE

5.5 V

4.5 V

CMOS

INDUSTRIAL

2 ms

R-PDSO-N8

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

YES

MATTE TIN

NO LEAD

500 µm

DUAL

1 mm

3 mm

2 mm

MICROCHIP TECHNOLOGY INC

SON

HVSON,

compliant

Parametric results for: 93C46AT-I/MC under EEPROMs