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93LC56BT-E/OT
Microchip Technology Inc
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$0.2117 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 5 V | 2 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 5 µA | 2 µA | 5.5 V | 2.5 V | CMOS | AUTOMOTIVE | YES | 6 ms | SOFTWARE | R-PDSO-G6 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | TS 16949 | 40 | 6 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.45 mm | 2.9 mm | 1.55 mm | MICROCHIP TECHNOLOGY INC | SOT-23 | 6 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||
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93LC56BT-I/SN
Microchip Technology Inc
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$0.2207 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 5 V | 2 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | YES | 6 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | Microchip | SOP, | ||||||
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93LC56BT/SN
Microchip Technology Inc
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$0.2220 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 3 V | 2 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | SERIAL | 3 V | MICROWIRE | 1 µA | 1.5 µA | 6 V | 2.5 V | CMOS | COMMERCIAL | 6 ms | R-PDSO-G8 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | SOP, SOP8,.25 | |||||||||||
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93LC56BXT-I/SN
Microchip Technology Inc
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$0.2220 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 3 V | 2 MHz | EEPROM | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | YES | 6 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | SOP, SOP8,.25 | |||
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93LC56BT-I/OT
Microchip Technology Inc
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$0.2235 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 3 V | 2 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | YES | 6 ms | SOFTWARE | R-PDSO-G6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 6 | PLASTIC/EPOXY | LSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.45 mm | 2.9 mm | 1.55 mm | MICROCHIP TECHNOLOGY INC | SOT-23 | 6 | compliant | EAR99 | 8542.32.00.51 | Microchip | LSSOP, TSOP6,.11,37 | |||||
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93LC56B/P
Microchip Technology Inc
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$0.2834 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 3 V | 2 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | SERIAL | 3 V | MICROWIRE | 1 µA | 1.5 µA | 6 V | 2.5 V | CMOS | COMMERCIAL | 6 ms | R-PDIP-T8 | Not Qualified | e3 | 70 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.32 mm | 9.46 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | 0.300 INCH, PLASTIC, DIP-8 | ||||||||||||||
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93LC56B-I/SN
Microchip Technology Inc
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$0.2852 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 5 V | 2 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | YES | 6 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||
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93LC56B-I/MS
Microchip Technology Inc
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$0.2988 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 5 V | 2 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | YES | 6 ms | SOFTWARE | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | MSOP | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | TSSOP, TSSOP8,.19 | ||||
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93LC56BX-I/SN
Microchip Technology Inc
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$0.3098 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 3 V | 2 MHz | EEPROM | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | YES | 6 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | SOP, SOP8,.25 | |||
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93LC56B-I/ST
Microchip Technology Inc
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$0.3145 | Yes | Yes | Active | 2.048 kbit | 16 | 128X16 | 3 V | 2 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 128 | 128 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | YES | 6 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | TSSOP, TSSOP8,.25 |