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Parametric results for: AM27C010- under OTP ROMs

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Manufacturer Part Number: am27c010
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AM27C010-55EC
 AMD 		Check for Price No No Obsolete 1.0486 Mbit 8 128KX8 5 V 55 ns OTP ROM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY TSOP1 TSSOP32,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm ADVANCED MICRO DEVICES INC TSOP TSOP1, TSSOP32,.8,20 32 unknown EAR99 8542.32.00.71
AM27C010-70DC
 Rochester Electronics LLC 		Check for Price Active 1.0486 Mbit 8 128KX8 5 V 70 ns UVPROM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-CDIP-T32 70 °C NOT SPECIFIED NOT SPECIFIED 32 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.588 mm 42.1005 mm 15.24 mm ROCHESTER ELECTRONICS LLC DIP, unknown EAR99 8542.32.00.61
AM27C010-305DIB
 AMD 		Check for Price No Obsolete 1.0486 Mbit 8 128KX8 5 V 300 ns UVPROM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 1 mA 50 µA 5.25 V 4.75 V CMOS INDUSTRIAL R-GDIP-T32 Not Qualified e0 85 °C -40 °C 32 CERAMIC, GLASS-SEALED WDIP DIP32,.6 RECTANGULAR IN-LINE, WINDOW NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 5.588 mm 42.1005 mm 15.24 mm ADVANCED MICRO DEVICES INC DIP WDIP, DIP32,.6 32 unknown EAR99 8542.32.00.61
AM27C010-175LC
 AMD 		Check for Price No Obsolete 1.0486 Mbit 8 128KX8 5 V 170 ns UVPROM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.25 V 4.75 V CMOS COMMERCIAL R-CQCC-N32 Not Qualified e0 70 °C 32 CERAMIC, METAL-SEALED COFIRED WQCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER, WINDOW YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD 3.556 mm 13.97 mm 11.43 mm ADVANCED MICRO DEVICES INC QFJ WQCCN, LCC32,.45X.55 32 unknown EAR99 8542.32.00.61
AM27C010-255DI
 AMD 		Check for Price No No Obsolete 1.0486 Mbit 8 128KX8 5 V 250 ns UVPROM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.25 V 4.75 V CMOS INDUSTRIAL R-CDIP-T32 Not Qualified e0 85 °C -40 °C 32 CERAMIC, METAL-SEALED COFIRED WDIP DIP32,.6 RECTANGULAR IN-LINE, WINDOW NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.588 mm 42.1005 mm 15.24 mm ADVANCED MICRO DEVICES INC DIP WDIP, DIP32,.6 32 unknown EAR99 8542.32.00.61
AM27C010-255PI
 Rochester Electronics LLC 		Check for Price Active 4.1943 Mbit 8 512KX8 5 V 100 ns OTP ROM 1 512000 131.072 k ASYNCHRONOUS PARALLEL 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDIP-T32 e0 85 °C -40 °C 32 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.715 mm 42.037 mm 15.24 mm ROCHESTER ELECTRONICS LLC DIP, unknown EAR99 8542.32.00.71
AM27C010-255DCB
 Spansion 		Check for Price Obsolete 1.0486 Mbit 8 128KX8 5 V 250 ns UVPROM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 30 µA 5.25 V 4.75 V CMOS COMMERCIAL R-CDIP-T32 Not Qualified 70 °C 32 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.588 mm 42.1 mm 15.24 mm SPANSION INC DIP DIP, 32 unknown EAR99 8542.32.00.61
AM27C010-150EC
 AMD 		Check for Price No No Obsolete 1.0486 Mbit 8 128KX8 5 V 150 ns OTP ROM COMMON 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 Not Qualified e0 70 °C 32 PLASTIC/EPOXY TSOP1 TSSOP32,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm ADVANCED MICRO DEVICES INC TSOP TSOP1, TSSOP32,.8,20 32 unknown EAR99 8542.32.00.71
AM27C010-45DI5
 Cypress Semiconductor 		Check for Price Active CYPRESS SEMICONDUCTOR CORP compliant
AM27C010-150DIB
 Rochester Electronics LLC 		Check for Price Active 1.0486 Mbit 8 128KX8 5 V 150 ns UVPROM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-CDIP-T32 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 32 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.588 mm 42.1005 mm 15.24 mm ROCHESTER ELECTRONICS LLC DIP, unknown EAR99 8542.32.00.61
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