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Manufacturer Part Number: am27c020200
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AM27C020-200DC
 AMD 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-CDIP-T32 Not Qualified e0 70 °C 32 CERAMIC, METAL-SEALED COFIRED DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP DIP, DIP32,.6 32 unknown EAR99 8542.32.00.61
AM27C020-200DI
 AMD 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-CDIP-T32 Not Qualified e0 85 °C -40 °C 32 CERAMIC, METAL-SEALED COFIRED DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP DIP, DIP32,.6 32 unknown EAR99 8542.32.00.61
AM27C020-200DE
 Spansion 		Check for Price Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM 1 256000 262.144 k ASYNCHRONOUS PARALLEL 30 µA CMOS MILITARY R-CDIP-T32 125 °C -55 °C 32 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.58 mm 42.1 mm 15.24 mm SPANSION INC DIP DIP, 32 unknown 3A001.A.2.C 8542.32.00.61
AM27C020-200DCB
 Spansion 		Check for Price Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM 1 256000 262.144 k ASYNCHRONOUS PARALLEL 30 µA CMOS COMMERCIAL R-CDIP-T32 70 °C 32 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.58 mm 42.1 mm 15.24 mm SPANSION INC DIP DIP, 32 unknown EAR99 8542.32.00.61
AM27C020-200DE
 AMD 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 60 µA 5.5 V 4.5 V CMOS MILITARY R-CDIP-T32 Not Qualified e0 125 °C -55 °C 32 CERAMIC, METAL-SEALED COFIRED DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP DIP, DIP32,.6 32 unknown 3A001.A.2.C 8542.32.00.61
AM27C020-200DC
 Spansion 		Check for Price Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM 1 256000 262.144 k ASYNCHRONOUS PARALLEL 30 µA CMOS COMMERCIAL R-CDIP-T32 70 °C 32 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.58 mm 42.1 mm 15.24 mm SPANSION INC DIP DIP, 32 unknown EAR99 8542.32.00.61
AM27C020-200DEB
 AMD 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 60 µA 5.5 V 4.5 V CMOS MILITARY R-CDIP-T32 Not Qualified e0 125 °C -55 °C 32 CERAMIC, METAL-SEALED COFIRED DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP DIP, DIP32,.6 32 unknown 3A001.A.2.C 8542.32.00.61
AM27C020-200DCB
 AMD 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS COMMERCIAL R-CDIP-T32 Not Qualified e0 70 °C 32 CERAMIC, METAL-SEALED COFIRED DIP DIP32,.6 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP DIP, DIP32,.6 32 unknown EAR99 8542.32.00.61
AM27C020-200LE
 AMD 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 60 µA 5.5 V 4.5 V CMOS MILITARY R-CQCC-N32 Not Qualified e0 125 °C -55 °C 32 CERAMIC, METAL-SEALED COFIRED WQCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER, WINDOW YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD 3.556 mm 13.97 mm 11.43 mm ADVANCED MICRO DEVICES INC QFJ WQCCN, LCC32,.45X.55 32 unknown 3A001.A.2.C 8542.32.00.61
AM27C020-200LIB
 AMD 		Check for Price No Obsolete 2.0972 Mbit 8 256KX8 5 V 200 ns UVPROM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 30 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-CQCC-N32 Not Qualified e0 85 °C -40 °C 32 CERAMIC, METAL-SEALED COFIRED WQCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER, WINDOW YES Tin/Lead (Sn/Pb) NO LEAD 1.27 mm QUAD 3.556 mm 13.97 mm 11.43 mm ADVANCED MICRO DEVICES INC QFJ WQCCN, LCC32,.45X.55 32 unknown EAR99 8542.32.00.61
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