Findchips: Parametric Search Results for AM29BDD160GB17DKF

Parametric results for: AM29BDD160GB17DKF under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		AM29BDD160GB-64CDPF1 Spansion
		AM29BDD160GB54DPBK Spansion
		AM29BDD160GB64CPBE AMD
		AM29BDD160GB-64CDGI1 Spansion
		AM29BDD160GB64CKE AMD
		AM29BDD160GB64CPBF Spansion
		AM29BDD160GB-64CDPK1 Spansion
		AM29BDD160GB80CKE AMD
		AM29BDD160GB90AKI Spansion
		AM29BDD160GB54DKF Spansion

			Most Relevant						Technical																							Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

16.7772 Mbit

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

INDUSTRIAL

NOR TYPE

R-XUUC-N76

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

NO LEAD

UPPER

SPANSION INC

DIE

DIE-76

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

512KX32

2.6 V

54 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

AUTOMOTIVE

NOR TYPE

R-PBGA-B80

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

16.7772 Mbit

8K,64K

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

60 µA

90 µA

2.75 V

2.5 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PBGA-B80

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA80,8X10,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, BGA-80

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

16.7772 Mbit

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

INDUSTRIAL

NOR TYPE

R-XUUC-N76

Not Qualified

85 °C

-40 °C

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

TIN LEAD

NO LEAD

UPPER

SPANSION INC

DIE

DIE-76

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

16.7772 Mbit

8K,64K

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

60 µA

90 µA

2.75 V

2.5 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PQFP-G80

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

GULL WING

800 µm

QUAD

3.35 mm

20 mm

14 mm

ADVANCED MICRO DEVICES INC

QFP

PLASTIC, QFP-80

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

AUTOMOTIVE

NOR TYPE

R-XUUC-N76

Not Qualified

125 °C

-40 °C

260

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

NO LEAD

UPPER

SPANSION INC

DIE

DIE-76

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

16.7772 Mbit

8K,64K

512KX32

2.6 V

80 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

30 µA

90 µA

2.75 V

2.5 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PQFP-G80

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

GULL WING

800 µm

QUAD

3.35 mm

20 mm

14 mm

ADVANCED MICRO DEVICES INC

QFP

PLASTIC, QFP-80

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

16.7772 Mbit

8K,64K

512KX32

2.6 V

90 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

30 µA

90 µA

2.75 V

2.5 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PQFP-G80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

YES

TIN LEAD

GULL WING

800 µm

QUAD

3.35 mm

20 mm

14 mm

SPANSION INC

QFP

PLASTIC, QFP-80

not_compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,64K

512KX32

2.6 V

54 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

60 µA

90 µA

2.75 V

2.5 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PQFP-G80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

YES

MATTE TIN

GULL WING

800 µm

QUAD

3.35 mm

20 mm

14 mm

SPANSION INC

QFP

LEAD FREE, PLASTIC, MO-108CB-1, QFP-80

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next

Compare

AM29BDD160GB-64CDPF1

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

INDUSTRIAL

NOR TYPE

R-XUUC-N76

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

NO LEAD

UPPER

SPANSION INC

DIE

DIE-76

compliant

EAR99

8542.32.00.51

AM29BDD160GB54DPBK

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

512KX32

2.6 V

54 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

AUTOMOTIVE

NOR TYPE

R-PBGA-B80

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80

compliant

EAR99

8542.32.00.51

AM29BDD160GB64CPBE

AMD

Check for Price

Transferred

16.7772 Mbit

8K,64K

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

60 µA

90 µA

2.75 V

2.5 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PBGA-B80

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA80,8X10,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, BGA-80

unknown

EAR99

8542.32.00.51

AM29BDD160GB-64CDGI1

Spansion

Check for Price

Obsolete

16.7772 Mbit

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

INDUSTRIAL

NOR TYPE

R-XUUC-N76

Not Qualified

85 °C

-40 °C

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

TIN LEAD

NO LEAD

UPPER

SPANSION INC

DIE

DIE-76

compliant

EAR99

8542.32.00.51

AM29BDD160GB64CKE

AMD

Check for Price

Transferred

16.7772 Mbit

8K,64K

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

60 µA

90 µA

2.75 V

2.5 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PQFP-G80

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

GULL WING

800 µm

QUAD

3.35 mm

20 mm

14 mm

ADVANCED MICRO DEVICES INC

QFP

PLASTIC, QFP-80

unknown

EAR99

8542.32.00.51

AM29BDD160GB64CPBF

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80

compliant

EAR99

8542.32.00.51

AM29BDD160GB-64CDPK1

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

512KX32

2.6 V

64 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

2.75 V

2.5 V

CMOS

AUTOMOTIVE

NOR TYPE

R-XUUC-N76

Not Qualified

125 °C

-40 °C

260

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

NO LEAD

UPPER

SPANSION INC

DIE

DIE-76

compliant

EAR99

8542.32.00.51

AM29BDD160GB80CKE

AMD

Check for Price

Transferred

16.7772 Mbit

8K,64K

512KX32

2.6 V

80 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

30 µA

90 µA

2.75 V

2.5 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PQFP-G80

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

YES

Tin/Lead (Sn/Pb)

GULL WING

800 µm

QUAD

3.35 mm

20 mm

14 mm

ADVANCED MICRO DEVICES INC

QFP

PLASTIC, QFP-80

unknown

EAR99

8542.32.00.51

AM29BDD160GB90AKI

Spansion

Check for Price

Obsolete

16.7772 Mbit

8K,64K

512KX32

2.6 V

90 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

30 µA

90 µA

2.75 V

2.5 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PQFP-G80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

YES

TIN LEAD

GULL WING

800 µm

QUAD

3.35 mm

20 mm

14 mm

SPANSION INC

QFP

PLASTIC, QFP-80

not_compliant

EAR99

8542.32.00.51

AM29BDD160GB54DKF

Spansion

Check for Price

Yes

Obsolete

16.7772 Mbit

8K,64K

512KX32

2.6 V

54 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

BOTTOM

YES

16,30

512000

524.288 k

ASYNCHRONOUS

PARALLEL

2.7 V

YES

60 µA

90 µA

2.75 V

2.5 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PQFP-G80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

QFP

QFP80,.7X.9,32

RECTANGULAR

FLATPACK

YES

MATTE TIN

GULL WING

800 µm

QUAD

3.35 mm

20 mm

14 mm

SPANSION INC

QFP

LEAD FREE, PLASTIC, MO-108CB-1, QFP-80

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next