Findchips: Parametric Search Results for AM29DL322GT70

Parametric results for: AM29DL322GT70 under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		AM29DL322GT70EK Spansion
		AM29DL322GT70PCI AMD
		AM29DL322GT70WDI AMD
		AM29DL322GT70RWDI AMD
		AM29DL322GT70RWMI Spansion
		AM29DL322GT70FKN Spansion
		AM29DL322GT70PCI Spansion
		AM29DL322GT70RPCI Spansion
		AM29DL322GT70RPCI AMD
		AM29DL322GT70FI AMD

			Most Relevant						Technical																							Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Reverse Pinout	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

TOP

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

MO-142DD, TSOP-48

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

11 X 13 MM, 1 MM PITCH, FORTIFIED, BGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

8 X 14 MM, 0,80 MM PITCH, FBGA-63

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

TOP

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1-R

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

TSOP1-R,

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

11 X 13 MM, 1 MM PITCH, FBGA-64

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

11 X 13 MM, 1 MM PITCH, FBGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1-R

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP

TSOP1-R, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next

Compare

AM29DL322GT70EK

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

TOP

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

MO-142DD, TSOP-48

compliant

3A001.A.2.C

8542.32.00.51

AM29DL322GT70PCI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

11 X 13 MM, 1 MM PITCH, FORTIFIED, BGA-64

unknown

EAR99

8542.32.00.51

AM29DL322GT70WDI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

8 X 14 MM, 0.80 MM PITCH, FBGA-63

unknown

EAR99

8542.32.00.51

AM29DL322GT70RWDI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

14 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

8 X 14 MM, 0,80 MM PITCH, FBGA-63

unknown

EAR99

8542.32.00.51

AM29DL322GT70RWMI

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

6 mm

SPANSION INC

BGA

6 X 12 MM, 0.80 MM PITCH, FBGA-48

not_compliant

EAR99

8542.32.00.51

AM29DL322GT70FKN

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

FLASH

TOP

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1-R

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

TSOP1-R,

compliant

3A001.A.2.C

8542.32.00.51

AM29DL322GT70PCI

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

not_compliant

EAR99

8542.32.00.51

AM29DL322GT70RPCI

Spansion

Check for Price

Obsolete

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

11 X 13 MM, 1 MM PITCH, FBGA-64

not_compliant

EAR99

8542.32.00.51

AM29DL322GT70RPCI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

11 X 13 MM, 1 MM PITCH, FBGA-64

unknown

EAR99

8542.32.00.51

AM29DL322GT70FI

AMD

Check for Price

Transferred

33.5544 Mbit

8K,64K

2MX16

3 V

70 ns

FLASH

TOP

YES

8,63

2000000

2.0972 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1-R

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

ADVANCED MICRO DEVICES INC

TSOP

TSOP1-R, TSSOP48,.8,20

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next