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Manufacturer Part Number: am29dl323dt120wde
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AM29DL323DT120WDEN
 Cypress Semiconductor 		Check for Price No Active 33.5544 Mbit 8K,64K 2MX16 3/3.3 V 120 ns FLASH 8 TOP YES YES YES 8,63 2000000 2.0972 M PARALLEL YES 5 µA 45 µA CMOS MILITARY YES NOR TYPE R-PBGA-B63 Not Qualified 125 °C -55 °C 63 PLASTIC/EPOXY FBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
AM29DL323DT120WDE
 Cypress Semiconductor 		Check for Price No Active 33.5544 Mbit 8K,64K 2MX16 3/3.3 V 120 ns FLASH 8 TOP YES YES YES 8,63 2000000 2.0972 M PARALLEL YES 5 µA 45 µA CMOS MILITARY YES NOR TYPE R-PBGA-B63 Not Qualified 125 °C -55 °C 63 PLASTIC/EPOXY FBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant
AM29DL323DT120WDEB
 AMD 		Check for Price Transferred 33.5544 Mbit 16 2MX16 3 V 120 ns FLASH 8 TOP 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS MILITARY NOR TYPE R-PBGA-B63 Not Qualified 125 °C -55 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm ADVANCED MICRO DEVICES INC unknown BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 3A001.A.2.C 8542.32.00.51
AM29DL323DT120WDE
 AMD 		Check for Price No Transferred 33.5544 Mbit 16 8K,64K 2MX16 3 V 120 ns FLASH MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION 8 TOP YES YES YES 20 1 8,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 45 µA 3.6 V 2.7 V CMOS MILITARY YES NOR TYPE R-PBGA-B63 Not Qualified e0 125 °C -55 °C 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm ADVANCED MICRO DEVICES INC unknown BGA TFBGA, BGA63,8X12,32 63 3A001.A.2.C 8542.32.00.51
AM29DL323DT120WDE
 Spansion 		Check for Price No Obsolete 33.5544 Mbit 16 8K,64K 2MX16 3 V 120 ns FLASH 8 TOP YES YES YES 1 8,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 45 µA 3.6 V 2.7 V CMOS MILITARY YES NOR TYPE R-PBGA-B63 Not Qualified e0 3 125 °C -55 °C 260 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm SPANSION INC not_compliant BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 3A001.A.2.C 8542.32.00.51
AM29DL323DT120WDEN
 Spansion 		Check for Price No Obsolete 33.5544 Mbit 16 8K,64K 2MX16 3 V 120 ns FLASH 8 TOP YES YES YES 1 8,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 45 µA 3.6 V 2.7 V CMOS MILITARY YES NOR TYPE R-PBGA-B63 Not Qualified e0 3 125 °C -55 °C 260 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm SPANSION INC not_compliant BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 3A001.A.2.C 8542.32.00.51
AM29DL323DT120WDEN
 AMD 		Check for Price No Transferred 33.5544 Mbit 16 8K,64K 2MX16 3 V 120 ns FLASH MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION 8 TOP YES YES YES 20 1 8,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 45 µA 3.6 V 2.7 V CMOS MILITARY YES NOR TYPE R-PBGA-B63 Not Qualified e0 125 °C -55 °C 63 PLASTIC/EPOXY TFBGA BGA63,8X12,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm ADVANCED MICRO DEVICES INC unknown BGA TFBGA, BGA63,8X12,32 63 3A001.A.2.C 8542.32.00.51
AM29DL323DT120WDEB
 Spansion 		Check for Price No Obsolete 33.5544 Mbit 16 2MX16 3 V 120 ns FLASH 8 TOP 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS MILITARY NOR TYPE R-PBGA-B63 Not Qualified e0 3 125 °C -55 °C 63 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 14 mm 8 mm SPANSION INC compliant BGA 8 X 14 MM, 0.80 MM PITCH, FBGA-63 63 3A001.A.2.C 8542.32.00.51