Findchips: Parametric Search Results for AM29LV128MH110EI

Parametric results for: AM29LV128MH110EI under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM29LV128MH118FI Spansion
		AM29LV128MH112PCF Spansion
		AM29LV128MH11RPCFN AMD
		AM29LV128MH113REF AMD
		AM29LV128MH119FI AMD
		AM29LV128MH119PCI AMD
		AM29LV128MH113RFI Spansion
		AM29LV128MH114EI AMD
		AM29LV128MH114PCI Spansion
		AM29LV128MH118EF Spansion

				Most Relevant						Technical																								Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Reverse Pinout	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1-R

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

TSOP

REVERSE, TSOP-56

not_compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

110 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

64K

8MX16

110 ns

FLASH

YES

256

8000000

8.3886 M

4/8 words

PARALLEL

YES

5 µA

80 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

ADVANCED MICRO DEVICES INC

BGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

134.2177 Mbit

64K

8MX16

110 ns

FLASH

YES

256

8000000

8.3886 M

4/8 words

PARALLEL

YES

5 µA

80 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1-R

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

ADVANCED MICRO DEVICES INC

TSOP1

REVERSE, MO-142B, TSOP-56

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

134.2177 Mbit

64K

8MX16

3.3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

TSOP1

REVERSE, PLASTIC, MO-142EC, TSOP-56

not_compliant

EAR99

8542.32.00.51

Check for Price

Transferred

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

ADVANCED MICRO DEVICES INC

TSOP1

MO-142B, TSOP-56

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

not_compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

TSOP

TSOP-56

compliant

EAR99

8542.32.00.51

1 2 3 4 5 Next

Compare

AM29LV128MH118FI

Spansion

Check for Price

Obsolete

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1-R

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

TSOP

REVERSE, TSOP-56

not_compliant

EAR99

8542.32.00.51

AM29LV128MH112PCF

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

110 ns

FLASH

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FBGA-64

compliant

EAR99

8542.32.00.51

AM29LV128MH11RPCFN

AMD

Check for Price

Yes

Transferred

134.2177 Mbit

64K

8MX16

110 ns

FLASH

YES

256

8000000

8.3886 M

4/8 words

PARALLEL

YES

5 µA

80 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

ADVANCED MICRO DEVICES INC

BGA, BGA64,8X8,40

unknown

EAR99

8542.32.00.51

AM29LV128MH113REF

AMD

Check for Price

Yes

Transferred

134.2177 Mbit

64K

8MX16

110 ns

FLASH

YES

256

8000000

8.3886 M

4/8 words

PARALLEL

YES

5 µA

80 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

AM29LV128MH119FI

AMD

Check for Price

Transferred

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1-R

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

ADVANCED MICRO DEVICES INC

TSOP1

REVERSE, MO-142B, TSOP-56

unknown

EAR99

8542.32.00.51

AM29LV128MH119PCI

AMD

Check for Price

Transferred

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

unknown

EAR99

8542.32.00.51

AM29LV128MH113RFI

Spansion

Check for Price

Obsolete

134.2177 Mbit

64K

8MX16

3.3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

80 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

TSOP1

REVERSE, PLASTIC, MO-142EC, TSOP-56

not_compliant

EAR99

8542.32.00.51

AM29LV128MH114EI

AMD

Check for Price

Transferred

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

ADVANCED MICRO DEVICES INC

TSOP1

MO-142B, TSOP-56

unknown

EAR99

8542.32.00.51

AM29LV128MH114PCI

Spansion

Check for Price

Obsolete

134.2177 Mbit

64K

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

8000000

8.3886 M

ASYNCHRONOUS

4/8 words

PARALLEL

3 V

YES

5 µA

60 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

BGA

13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64

not_compliant

EAR99

8542.32.00.51

AM29LV128MH118EF

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

3 V

110 ns

FLASH

BOTTOM/TOP

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

Matte Tin (Sn)

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

14 mm

SPANSION INC

TSOP

TSOP-56

compliant

EAR99

8542.32.00.51

1 2 3 4 5 Next