Findchips: Parametric Search Results for AM29LV200BB35DTI1

Parametric results for: AM29LV200BB35DTI1 under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		AM29LV200BB-80EK Spansion
		AM29LV200BB-60RDWI Spansion
		AM29LV200BB-120DPI AMD
		AM29LV200BB-120WAF Spansion
		AM29LV200BB-80FK Spansion
		AM29LV200BB-55REI Spansion
		AM29LV200BB-60RDWD Spansion
		AM29LV200BB-90WAI AMD
		AM29LV200BB-90SE AMD
		AM29LV200BB-120DTC1 Spansion

				Most Relevant						Technical																								Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Data Retention Time-Min	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

2.0972 Mbit

256KX8

3 V

80 ns

FLASH

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

TSOP-48

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

2.0972 Mbit

128KX16

3.3 V

60 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-XUUC-N43

Not Qualified

85 °C

-40 °C

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

TIN LEAD

NO LEAD

UPPER

SPANSION INC

WAFER

WAFER-43

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

2.0972 Mbit

128KX16

3 V

120 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-XUUC-N43

Not Qualified

85 °C

-40 °C

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

NO LEAD

UPPER

ADVANCED MICRO DEVICES INC

DIE

DIE-43

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

2.0972 Mbit

128KX16

3 V

120 ns

FLASH

BOTTOM BOOT BLOCK

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

TFBGA,

compliant

Check for Price

Yes

Obsolete

2.0972 Mbit

256KX8

3 V

80 ns

FLASH

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1-R

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

REVERSE, TSOP-48

compliant

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

2.0972 Mbit

16K,8K,32K,64K

128KX16

3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,3

128000

131.072 k

SYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

MO-142DD, TSOP-48

not_compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

2.0972 Mbit

128KX16

3.3 V

60 ns

FLASH

BOTTOM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

COMMERCIAL

NOR TYPE

R-XUUC-N43

Not Qualified

70 °C

260

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

NO LEAD

UPPER

SPANSION INC

WAFER

WAFER-43

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

2.0972 Mbit

16K,8K,32K,64K

128KX16

3 V

90 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,3

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

Check for Price

Transferred

2.0972 Mbit

16K,8K,32K,64K

128KX16

3 V

90 ns

FLASH

MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA... more

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,3

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PDSO-G44

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

SOP

SOP44,.63

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

ADVANCED MICRO DEVICES INC

SOIC

SOP, SOP44,.63

unknown

3A001.A.2.C

8542.32.00.51

Check for Price

Obsolete

2.0972 Mbit

128KX16

3 V

120 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

Not Qualified

70 °C

UNSPECIFIED

DIE

UNCASED CHIP

YES

NO LEAD

UPPER

SPANSION INC

DIE

SURF TAPE PACKAGE-43

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next

Compare

AM29LV200BB-80EK

Spansion

Check for Price

Yes

Obsolete

2.0972 Mbit

256KX8

3 V

80 ns

FLASH

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

TSOP-48

compliant

3A001.A.2.C

8542.32.00.51

AM29LV200BB-60RDWI

Spansion

Check for Price

Obsolete

2.0972 Mbit

128KX16

3.3 V

60 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

INDUSTRIAL

NOR TYPE

R-XUUC-N43

Not Qualified

85 °C

-40 °C

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

TIN LEAD

NO LEAD

UPPER

SPANSION INC

WAFER

WAFER-43

compliant

EAR99

8542.32.00.51

AM29LV200BB-120DPI

AMD

Check for Price

Transferred

2.0972 Mbit

128KX16

3 V

120 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-XUUC-N43

Not Qualified

85 °C

-40 °C

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

NO LEAD

UPPER

ADVANCED MICRO DEVICES INC

DIE

DIE-43

unknown

EAR99

8542.32.00.51

AM29LV200BB-120WAF

Spansion

Check for Price

Yes

Obsolete

2.0972 Mbit

128KX16

3 V

120 ns

FLASH

BOTTOM BOOT BLOCK

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

TFBGA,

compliant

AM29LV200BB-80FK

Spansion

Check for Price

Yes

Obsolete

2.0972 Mbit

256KX8

3 V

80 ns

FLASH

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

MILITARY

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

TSOP1-R

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP

REVERSE, TSOP-48

compliant

3A001.A.2.C

8542.32.00.51

AM29LV200BB-55REI

Spansion

Check for Price

Obsolete

2.0972 Mbit

16K,8K,32K,64K

128KX16

3 V

55 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,3

128000

131.072 k

SYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

TIN LEAD

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

MO-142DD, TSOP-48

not_compliant

EAR99

8542.32.00.51

AM29LV200BB-60RDWD

Spansion

Check for Price

Yes

Obsolete

2.0972 Mbit

128KX16

3.3 V

60 ns

FLASH

BOTTOM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

3 V

CMOS

COMMERCIAL

NOR TYPE

R-XUUC-N43

Not Qualified

70 °C

260

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

YES

NO LEAD

UPPER

SPANSION INC

WAFER

WAFER-43

compliant

EAR99

8542.32.00.51

AM29LV200BB-90WAI

AMD

Check for Price

Transferred

2.0972 Mbit

16K,8K,32K,64K

128KX16

3 V

90 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,3

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

8.15 mm

6.15 mm

ADVANCED MICRO DEVICES INC

BGA

6 X 8 MM, 0.80 MM PITCH, FBGA-48

unknown

EAR99

8542.32.00.51

AM29LV200BB-90SE

AMD

Check for Price

Transferred

2.0972 Mbit

16K,8K,32K,64K

128KX16

3 V

90 ns

FLASH

MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA... more

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,3

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

30 µA

3.6 V

2.7 V

CMOS

MILITARY

YES

NOR TYPE

R-PDSO-G44

Not Qualified

125 °C

-55 °C

PLASTIC/EPOXY

SOP

SOP44,.63

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

ADVANCED MICRO DEVICES INC

SOIC

SOP, SOP44,.63

unknown

3A001.A.2.C

8542.32.00.51

AM29LV200BB-120DTC1

Spansion

Check for Price

Obsolete

2.0972 Mbit

128KX16

3 V

120 ns

FLASH

BOTTOM BOOT BLOCK

BOTTOM

128000

131.072 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

COMMERCIAL

NOR TYPE

Not Qualified

70 °C

UNSPECIFIED

DIE

UNCASED CHIP

YES

NO LEAD

UPPER

SPANSION INC

DIE

SURF TAPE PACKAGE-43

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next