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Parametric » Memory » Flash Memories

Parametric results for: AM29LV640GU53RWHI under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		AM29LV640GU53RWHI AMD
		AM29LV640GU53RWHI Cypress Semiconductor
		AM29LV640GU53RWHI Spansion

			Most Relevant							Technical																					Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

No

Transferred

67.1089 Mbit

16

32K

4MX16

3.3 V

55 ns

FLASH

BOTTOM/TOP

YES

YES

YES

1

128

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

26 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

e0

85 °C

-40 °C

63

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

11 X 12 MM, 0.80 MM PITCH, FBGA-63

63

unknown

EAR99

8542.32.00.51

Check for Price

No

Active

67.1089 Mbit

32K

4MX16

3.3 V

3.3 V

55 ns

FLASH

YES

YES

YES

128

4000000

4.1943 M

PARALLEL

YES

5 µA

26 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

63

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

No

Obsolete

67.1089 Mbit

16

32K

4MX16

3.3 V

55 ns

FLASH

BOTTOM/TOP

YES

YES

YES

1

128

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

26 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

e0

3

85 °C

-40 °C

260

63

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

BGA

11 X 12 MM, 0.80 MM PITCH, FBGA-63

63

not_compliant

EAR99

8542.32.00.51

Compare

AM29LV640GU53RWHI

AMD

Check for Price

No

Transferred

67.1089 Mbit

16

32K

4MX16

3.3 V

55 ns

FLASH

BOTTOM/TOP

YES

YES

YES

1

128

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

26 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

e0

85 °C

-40 °C

63

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

ADVANCED MICRO DEVICES INC

BGA

11 X 12 MM, 0.80 MM PITCH, FBGA-63

63

unknown

EAR99

8542.32.00.51

AM29LV640GU53RWHI

Cypress Semiconductor

Check for Price

No

Active

67.1089 Mbit

32K

4MX16

3.3 V

3.3 V

55 ns

FLASH

YES

YES

YES

128

4000000

4.1943 M

PARALLEL

YES

5 µA

26 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

85 °C

-40 °C

63

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

AM29LV640GU53RWHI

Spansion

Check for Price

No

Obsolete

67.1089 Mbit

16

32K

4MX16

3.3 V

55 ns

FLASH

BOTTOM/TOP

YES

YES

YES

1

128

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

26 µA

3.6 V

3 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

e0

3

85 °C

-40 °C

260

63

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

BGA

11 X 12 MM, 0.80 MM PITCH, FBGA-63

63

not_compliant

EAR99

8542.32.00.51