Parametric results for: AM29LV640MH101R under Flash Memories

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Manufacturer Part Number: am29lv640mh101r
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AM29LV640MH101REF
Spansion
Check for Price Yes Obsolete 67.1089 Mbit 16 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 56 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 MO-142EC, TSOP-56 56 compliant EAR99 8542.32.00.51
AM29LV640MH101RPCI
AMD
Check for Price No Transferred 67.1089 Mbit 16 64K 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 85 °C -40 °C 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Lead (Sn/Pb) BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm ADVANCED MICRO DEVICES INC BGA 13 X 11 MM, 1 MM PITCH, BGA-64 64 unknown EAR99 8542.32.00.51
AM29LV640MH101RFF
Spansion
Check for Price Yes Obsolete 67.1089 Mbit 16 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 56 PLASTIC/EPOXY TSOP1-R RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 REVERSE, MO-142EC, TSOP-56 56 compliant EAR99 8542.32.00.51
AM29LV640MH101RFI
Spansion
Check for Price No Obsolete 67.1089 Mbit 16 64K 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 85 °C -40 °C 260 56 PLASTIC/EPOXY TSOP1-R TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 REVERSE, MO-142EC, TSOP-56 56 not_compliant EAR99 8542.32.00.51
AM29LV640MH101REI
Spansion
Check for Price No No Obsolete 67.1089 Mbit 16 64K 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 85 °C -40 °C 260 56 PLASTIC/EPOXY TSOP1 TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 MO-142EC, TSOP-56 56 not_compliant EAR99 8542.32.00.51
AM29LV640MH101REI
AMD
Check for Price No Transferred 67.1089 Mbit 16 64K 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 85 °C -40 °C 56 PLASTIC/EPOXY TSOP1 TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm ADVANCED MICRO DEVICES INC TSOP1 MO-142, TSOP-56 56 unknown EAR99 8542.32.00.51
AM29LV640MH101RFI
Cypress Semiconductor
Check for Price No Active 67.1089 Mbit 64K 4MX16 3/3.3,3.3 V 100 ns FLASH 8 YES YES YES 128 4000000 4.1943 M 4/8 words PARALLEL YES YES 5 µA 60 µA CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY TSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL CYPRESS SEMICONDUCTOR CORP compliant
AM29LV640MH101RFI
AMD
Check for Price No Transferred 67.1089 Mbit 16 64K 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 85 °C -40 °C 56 PLASTIC/EPOXY TSOP1-R TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Tin/Lead (Sn/Pb) GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm ADVANCED MICRO DEVICES INC TSOP1 REVERSE, MO-142, TSOP-56 56 unknown EAR99 8542.32.00.51
AM29LV640MH101RPCF
Spansion
Check for Price Yes Obsolete 67.1089 Mbit 16 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 3 V 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 64 PLASTIC/EPOXY LBGA RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64 64 compliant EAR99 8542.32.00.51
AM29LV640MH101RPCI
Spansion
Check for Price No No Obsolete 67.1089 Mbit 16 64K 4MX16 3.3 V 100 ns FLASH 8 BOTTOM/TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e0 3 85 °C -40 °C 260 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64 64 not_compliant EAR99 8542.32.00.51