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AM29LV800BB-90WBK
AMD
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Check for Price | Yes | Transferred | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 90 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,15 | 512000 | 524.288 k | PARALLEL | YES | 5 µA | 30 µA | CMOS | MILITARY | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 125 °C | -55 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | unknown | 3A001.A.2.C | 8542.32.00.51 | ||||||||||||||||||||||
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AM29LV800BB-90WBK
Cypress Semiconductor
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Check for Price | Yes | Active | 8.3886 Mbit | 16K,8K,32K,64K | 512KX16 | 3/3.3 V | 90 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,15 | 512000 | 524.288 k | PARALLEL | YES | 5 µA | 30 µA | CMOS | MILITARY | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 125 °C | -55 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | ||||||||||||||||||||||||
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AM29LV800BB90WBK
Spansion
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Check for Price | Yes | Yes | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 3 V | 90 ns | FLASH | CONFIGURABLE AS 512K X 16; 1000K WRITE CYCLES MIN; DATA RETENTION 20 YEARS | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | MILITARY | R-PBGA-B48 | Not Qualified | e1 | 3 | 125 °C | -55 °C | 260 | 40 | 48 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | BOTTOM | SPANSION INC | compliant | BGA | BGA, | 48 | ||||||||||||||||||||||
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AM29LV800BB-90WBK
Spansion
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Check for Price | Yes | Obsolete | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3 V | 90 ns | FLASH | CAN ALSO BE OPERATED FROM 3 TO 3.6 VOLTS REGULATED; BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 2.7 V | CMOS | MILITARY | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 125 °C | -55 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 6 mm | SPANSION INC | unknown | 3A001.A.2.C | 8542.32.00.51 | BGA | 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | 48 |