Findchips: Parametric Search Results for AM41DL3208G

Parametric results for: AM41DL3208G under Other Memory ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		AM41DL3208GB85IT AMD
		AM41DL3208GT70IT AMD
		AM41DL3208GB70IT Spansion
		AM41DL3208GT70IT Spansion
		AM41DL3208GB85IT Spansion
		AM41DL3208GT85IT Spansion
		AM41DL3208GT85FT Spansion
		AM41DL3208GT85IT AMD
		AM41DL3208GB70FT Spansion
		AM41DL3208GB70IT AMD

				Most Relevant					Technical												Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Mixed Memory Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

STATIC RAM IS ORGANISED AS 1M X 8 OR 512... more

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

STATIC RAM IS ORGANISED AS 1M X 8 OR 512... more

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

LFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

STATIC RAM IS ORGANISED AS 1M X 8 OR 512... more

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

LFBGA,

compliant

EAR99

8542.32.00.71

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

STATIC RAM IS ORGANISED AS 1M X 8 OR 512... more

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

1 2 Next

Compare

AM41DL3208GB85IT

AMD

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

STATIC RAM IS ORGANISED AS 1M X 8 OR 512... more

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

AM41DL3208GT70IT

AMD

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

STATIC RAM IS ORGANISED AS 1M X 8 OR 512... more

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

AM41DL3208GB70IT

Spansion

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

AM41DL3208GT70IT

Spansion

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

AM41DL3208GB85IT

Spansion

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

AM41DL3208GT85IT

Spansion

Check for Price

Obsolete

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

AM41DL3208GT85FT

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

LFBGA,

compliant

EAR99

8542.32.00.71

AM41DL3208GT85IT

AMD

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

STATIC RAM IS ORGANISED AS 1M X 8 OR 512... more

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

AM41DL3208GB70FT

Spansion

Check for Price

Yes

Obsolete

33.5544 Mbit

2MX16

3 V

MEMORY CIRCUIT

SRAM IS ORGANISED AS 512K X 16 OR 1M X 8; FLASH CAN ALSO BE ORGANISED AS 4M X 8

2000000

2.0972 M

ASYNCHRONOUS

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

LFBGA,

compliant

EAR99

8542.32.00.71

AM41DL3208GB70IT

AMD

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

70 ns

MEMORY CIRCUIT

STATIC RAM IS ORGANISED AS 1M X 8 OR 512... more

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

1 2 Next