Findchips: Parametric Search Results for AM42DL3224GB85IT


Select Parts		Part Number

		AM42DL3224GB85IT Spansion
		AM42DL3224GB85IT AMD
		AM42DL3224GB85IT Cypress Semiconductor

			Most Relevant						Technical												Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Additional Feature	Mixed Memory Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

PSEUDO SRAM IS ORGANISED AS 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

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Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

PSEUDO SRAM IS ORGANISED AS 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

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Active

3 V

85 ns

MEMORY CIRCUIT

FLASH+SRAM

45 µA

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Compare

AM42DL3224GB85IT

Spansion

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Obsolete

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

PSEUDO SRAM IS ORGANISED AS 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

AM42DL3224GB85IT

AMD

Check for Price

Transferred

33.5544 Mbit

2MX16

3 V

85 ns

MEMORY CIRCUIT

PSEUDO SRAM IS ORGANISED AS 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8

FLASH+SRAM

2000000

2.0972 M

ASYNCHRONOUS

45 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

AM42DL3224GB85IT

Cypress Semiconductor

Check for Price

Active

3 V

85 ns

MEMORY CIRCUIT

FLASH+SRAM

45 µA

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Parametric results for: AM42DL3224GB85IT under Other Memory ICs