Findchips: Parametric Search Results for AM50DL9608GT75IT


Select Parts		Part Number

		AM50DL9608GT75IT AMD
		AM50DL9608GT75IT Cypress Semiconductor
		AM50DL9608GT75IT Spansion

			Most Relevant						Technical													Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Power Supplies	Access Time-Max	Memory IC Type	Additional Feature	Mixed Memory Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

67.1089 Mbit

4MX16

3 V

75 ns

MEMORY CIRCUIT

PSEUDO SRAM IS ORGANISED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH

FLASH+PSRAM

4000000

4.1943 M

ASYNCHRONOUS

60 µA

30 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

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Active

3 V

75 ns

MEMORY CIRCUIT

FLASH+PSRAM

60 µA

30 µA

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

75 ns

MEMORY CIRCUIT

PSEUDO SRAM IS ORGANISED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH

FLASH+PSRAM

4000000

4.1943 M

ASYNCHRONOUS

60 µA

30 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

Compare

AM50DL9608GT75IT

AMD

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Transferred

67.1089 Mbit

4MX16

3 V

75 ns

MEMORY CIRCUIT

PSEUDO SRAM IS ORGANISED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH

FLASH+PSRAM

4000000

4.1943 M

ASYNCHRONOUS

60 µA

30 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

compliant

EAR99

8542.32.00.71

AM50DL9608GT75IT

Cypress Semiconductor

Check for Price

Active

3 V

75 ns

MEMORY CIRCUIT

FLASH+PSRAM

60 µA

30 µA

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

CYPRESS SEMICONDUCTOR CORP

compliant

AM50DL9608GT75IT

Spansion

Check for Price

Obsolete

67.1089 Mbit

4MX16

3 V

75 ns

MEMORY CIRCUIT

PSEUDO SRAM IS ORGANISED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH

FLASH+PSRAM

4000000

4.1943 M

ASYNCHRONOUS

60 µA

30 µA

3.3 V

2.7 V

CMOS

INDUSTRIAL

R-PBGA-B73

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.4 mm

11.6 mm

8 mm

SPANSION INC

BGA

8 X 11.60 MM, FBGA-73

not_compliant

EAR99

8542.32.00.71

Parametric results for: AM50DL9608GT75IT under Other Memory ICs