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Manufacturer Part Number: as9c2
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AS9C25256M2018L-133BC
 Integrated Silicon Solution Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 2.5 V 12 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 70 °C 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm INTEGRATED SILICON SOLUTION INC BGA LBGA, 256 compliant 3A991.B.2.A 8542.32.00.41
AS9C25256M2036L-250PC
 Alliance Semiconductor Corporation 		Check for Price No Transferred 9.4372 Mbit 36 256KX36 2.5 V 6.5 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS COMMERCIAL S-PQFP-G208 Not Qualified e0 70 °C 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 28 mm 28 mm ALLIANCE SEMICONDUCTOR CORP QFP FQFP, 208 unknown 3A991.B.2.A 8542.32.00.41
AS9C25512M2018L-250FC
 Integrated Silicon Solution Inc 		Check for Price No No Obsolete 9.4372 Mbit 18 512KX18 2.5 V 6.5 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 70 °C 208 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm INTEGRATED SILICON SOLUTION INC BGA LFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
AS9C25512M2018L-200BC
 Alliance Semiconductor Corporation 		Check for Price No Transferred 9.4372 Mbit 18 512KX18 2.5 V 7.5 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 70 °C 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm ALLIANCE SEMICONDUCTOR CORP BGA LBGA, 256 unknown 3A991.B.2.A 8542.32.00.41
AS9C25256M2036L-133PI
 Integrated Silicon Solution Inc 		Check for Price No No Obsolete 9.4372 Mbit 36 256KX36 2.5 V 12 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS INDUSTRIAL S-PQFP-G208 Not Qualified e0 85 °C -40 °C 208 PLASTIC/EPOXY FQFP SQUARE FLATPACK, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 28 mm 28 mm INTEGRATED SILICON SOLUTION INC QFP FQFP, 208 compliant 3A991.B.2.A 8542.32.00.41
AS9C25512M2018L-250TI
 Alliance Semiconductor Corporation 		Check for Price No Transferred 9.4372 Mbit 18 512KX18 2.5 V 6.5 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS INDUSTRIAL S-PQFP-G144 Not Qualified e0 85 °C -40 °C 144 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 1.6 mm 20 mm 20 mm ALLIANCE SEMICONDUCTOR CORP QFP LFQFP, 144 unknown 3A991.B.2.A 8542.32.00.41
AS9C25512M2018L-250BC
 Alliance Semiconductor Corporation 		Check for Price No Transferred 9.4372 Mbit 18 512KX18 2.5 V 6.5 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B256 Not Qualified e0 70 °C 256 PLASTIC/EPOXY LBGA SQUARE GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.6 mm 17 mm 17 mm ALLIANCE SEMICONDUCTOR CORP BGA LBGA, 256 unknown 3A991.B.2.A 8542.32.00.41
AS9C25256M2018L-133FC
 Integrated Silicon Solution Inc 		Check for Price No No Obsolete 4.7186 Mbit 18 256KX18 2.5 V 12 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 70 °C 208 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm INTEGRATED SILICON SOLUTION INC BGA LFBGA, 208 compliant 3A991.B.2.A 8542.32.00.41
AS9C25128M2036L-166FC
 Alliance Semiconductor Corporation 		Check for Price No Transferred 4.7186 Mbit 36 128KX36 2.5 V 10 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 70 °C 208 PLASTIC/EPOXY LFBGA SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm ALLIANCE SEMICONDUCTOR CORP BGA LFBGA, 208 unknown 3A991.B.2.A 8542.32.00.41
AS9C25512M2018L-200TI
 Alliance Semiconductor Corporation 		Check for Price No Transferred 9.4372 Mbit 18 512KX18 2.5 V 7.5 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.6 V 2.4 V CMOS INDUSTRIAL S-PQFP-G144 Not Qualified e0 85 °C -40 °C 144 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 1.6 mm 20 mm 20 mm ALLIANCE SEMICONDUCTOR CORP QFP LFQFP, 144 unknown 3A991.B.2.A 8542.32.00.41
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