Parametric results for: AT-252 under EEPROMs

All Filters Additional Feature Alternate Memory Width Clock Frequency-Max (fCLK) Data Retention Time-Min Endurance JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Mounting Feature Number of Functions Number of Ports Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Page Size Supply Voltage-Nom (Vsup)

100 YEAR DATA RETENTION 19 2.5V TO 5.5V @ 10MHz AND 1.8V TO 5.5V @ 5MHz 1 ALSO AVAILABLE 1.8-5.5V WITH 5MHZ FOR -40 TO 85 DEG CEL 3 ALSO OPERATES 1.8 V SUPPLY AT 5MHZ 4 ALSO OPERATES AT 10MHZ AT 2.7MIN SUPPLY 4 ALSO OPERATES AT 2.5V TO 5.5V @10MHZ AND 1.8V TO 5.5V @5MHZ 8 ALSO OPERATES AT MIN 1.8 V AT 5 MHZ 1 HARDWARE & SOFTWARE DATA PROTECTION; DATA RETENTION > 200 YEARS; 100K ENDURANCE WRITE CYCLES 33 IT ALSO OPERATES AT 4.5 TO 5.5 V SUPPLY VOLTAGE 2 IT OPERATE AT 10 AND 5 MHZ FREQUENCY AT 2.5 TO 5.5 V AND 1.8 TO 5.5 V SUPPLY VOLTAGE RESPECTIVELY 7

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1 3

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Clock Frequency-Max (fCLK) (6)

500 kHz 13 2.1 MHz 19 3 MHz 16 5 MHz 149 10 MHz 21 20 MHz 28

Min (MHz) - Max (MHz)

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100 113 200 61

Min - Max

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100000.0 Write/Erase Cycles 75 1000000.0 Write/Erase Cycles 99

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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R-CDSO-N8 10 R-PBGA-B8 21 R-PDIP-T8 42 R-PDSO-G20 12 R-PDSO-G8 146 R-PDSO-N8 19 R-XDSO-N8 13 R-XUUC-N8 2 X-XUUC-N 5

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e0 78 e1 2 e3 80 e4 73

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3 mm 15 3.73 mm 7 3.86 mm 4 4.4 mm 40 4.9 mm 50 4.925 mm 13 5.255 mm 5 5.29 mm 11 5.31 mm 11 5.99 mm 10 6 mm 3 6.5 mm 6 8 mm 6 9.27 mm 20 9.271 mm 18 9.59 mm 4

Min (mm) - Max (mm)

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Manufacturer (7)

Atmel Corporation 130 Catalyst Semiconductor 44 Kingbright 4 MACOM 1 Microchip Technology Inc 51 onsemi 54 Rochester Electronics LLC 3

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Memory Density (1)

262.144 kbit 270

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EEPROM 269

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Memory Width (1)

8 270

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1 102 2 6 3 15 NOT SPECIFIED 3

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SURFACE MOUNT 4

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1.0 252

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1 19

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2 4 20 12 8 253

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32.768 k 270

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32000.0 270

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SYNCHRONOUS 248

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70.0 °C 24 85.0 °C 157 100.0 °C 4 125.0 °C 89

Min (°C) - Max (°C)

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-40.0 °C 250 0.0 °C 24

Min (°C) - Max (°C)

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Organization (1)

32KX8 270

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3-STATE 19

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CERAMIC, METAL-SEALED COFIRED 10 PLASTIC/EPOXY 241 UNSPECIFIED 19

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DIE 7 DIP 42 FBGA 4 HVSON 24 SON 6 SOP 109 TSON 10 TSOP 6 TSOP2 1 TSSOP 50 VFBGA 9 VSON 2

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BGA8,2X4,30 12 DIP8,.3 22 SOLCC8,.11,20 3 SOLCC8,.12,20 6 SOLCC8,.2,25 4 SOLCC8,.25 13 SOLCC8,.3 6 SOP8,.23 7 SOP8,.25 29 SOP8,.3 29 TSOP20(UNSPEC) 6 TSSOP20,.25 6 TSSOP8,.25 31

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RECTANGULAR 265 UNSPECIFIED 5

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GRID ARRAY 8 GRID ARRAY, FINE PITCH 4 GRID ARRAY, VERY THIN PROFILE, FINE PITCH 9 IN-LINE 42 SMALL OUTLINE 112 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 23 SMALL OUTLINE, THIN PROFILE 17 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 46 SMALL OUTLINE, VERY THIN PROFILE 2 UNCASED CHIP 7

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64 words 8

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Supply Voltage-Nom (Vsup) (4)

2.5 V 21 2.7 V 22 3.3 V 7 5 V 202

Min (V) - Max (V)

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