Parametric results for: AT25XE011-XMHN-B under Flash Memories
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AT25XE011-XMHN-B
Adesto Technologies Corporation
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$1.0700 | Yes | Yes | Transferred | 1.0486 Mbit | 8 | 128KX8 | 1.8 V | 104 MHz | FLASH | 1 | 128000 | 131.072 k | SYNCHRONOUS | SERIAL | 1.8 V | 3.6 V | 1.65 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e4 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ADESTO TECHNOLOGIES CORP | TSSOP-8 | compliant | EAR99 | 8542.32.00.51 | Adesto Technologies | ||||||||||||||
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AT25XE011-XMHN-B
Renesas Electronics Corporation
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$1.2913 | Yes | Yes | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 1.8 V | 104 MHz | FLASH | ALSO OPERATES WITH 2.3VMIN SUPPLY | 20 | 100000 Write/Erase Cycles | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | SPI | 40 µA | 13 µA | 3.6 V | 1.65 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | e4 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | RENESAS ELECTRONICS CORP | UDFN-8 | compliant | Renesas Electronics | TSSOP | ||||
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AT25XE011-XMHN-B
Dialog Semiconductor GmbH
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Check for Price | Yes | Transferred | 1.0486 Mbit | 8 | 128KX8 | 1.8 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 128000 | 131.072 k | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | SPI | 15 µA | 13 µA | 3.6 V | 1.65 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE | R-PDSO-G8 | e4 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | NICKEL PALLADIUM GOLD | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | DIALOG SEMICONDUCTOR GMBH | compliant |