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AT28C256-25FM/883
Microchip Technology Inc
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$206.2690 | No | No | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | NO | YES | 10000 Write/Erase Cycles | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | 64 words | PARALLEL | 5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | YES | 10 ms | R-CDFP-F28 | Not Qualified | e0 | 1 | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class C | NOT SPECIFIED | 28 | CERAMIC, METAL-SEALED COFIRED | DFP | FL28,.4 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 3.02 mm | 18.285 mm | 10.16 mm | MICROCHIP TECHNOLOGY INC | CERAMIC, FP-28 | compliant | Microchip | ||||||
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AT28C256-25LM/883-815
Microchip Technology Inc
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$230.1787 | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-CQCC-N32 | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class C | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 2.54 mm | 13.97 mm | 11.43 mm | MICROCHIP TECHNOLOGY INC | LCC-32 | compliant | Microchip | 3A001.A.2.C | 8542.32.00.51 | |||||||||||||||||||
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AT28C256-25LM/883
Microchip Technology Inc
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$237.3940 | No | No | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | NO | YES | 10000 Write/Erase Cycles | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | 64 words | PARALLEL | 5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | YES | 10 ms | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class C | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 2.54 mm | 13.97 mm | 11.43 mm | MICROCHIP TECHNOLOGY INC | CERAMIC, LCC-32 | compliant | Microchip | |||||||
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AT28C256-25FM/883-815
Microchip Technology Inc
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$262.1863 | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-CDFP-F28 | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class C | NOT SPECIFIED | 28 | CERAMIC, METAL-SEALED COFIRED | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 1.27 mm | DUAL | 3.02 mm | 18.285 mm | 10.16 mm | MICROCHIP TECHNOLOGY INC | FP-28 | compliant | 3A001.A.2.C | 8542.32.00.51 | ||||||||||||||||||||
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AT28C256-25DM/883-815
Microchip Technology Inc
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$268.6669 | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-GDIP-T28 | e0 | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class C | NOT SPECIFIED | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.215 mm | 15.24 mm | MICROCHIP TECHNOLOGY INC | DIP-28 | compliant | Microchip | 3A001.A.2.C | 8542.32.00.51 | |||||||||||||||||
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AT28C256-25DM/883
Microchip Technology Inc
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$348.6195 | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-GDIP-T28 | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class C | NOT SPECIFIED | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.215 mm | 15.24 mm | MICROCHIP TECHNOLOGY INC | DIP-28 | compliant | Microchip | 3A001.A.2.C | 8542.32.00.51 | ||||||||||||||||||||
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AT28C256-25UM/883-815
Microchip Technology Inc
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$364.0772 | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-CPGA-P28 | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 Class C | NOT SPECIFIED | 28 | CERAMIC, METAL-SEALED COFIRED | PGA | RECTANGULAR | GRID ARRAY | NO | PIN/PEG | 2.54 mm | PERPENDICULAR | 4.4 mm | 16.51 mm | 13.97 mm | MICROCHIP TECHNOLOGY INC | PGA-28 | compliant | Microchip | 3A001.A.2.C | 8542.32.00.51 | ||||||||||||||||||
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AT28C256-25PI
Atmel Corporation
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | NO | YES | 10000 Write/Erase Cycles | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | 64 words | PARALLEL | 5 V | 200 µA | 50 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | YES | 10 ms | R-PDIP-T28 | Not Qualified | e0 | 85 °C | -40 °C | MIL-STD-883 | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 4.826 mm | 37.0205 mm | 15.24 mm | ATMEL CORP | DIP, DIP28,.6 | unknown | EAR99 | 8542.32.00.51 | DIP | 28 | |||||||
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AT28C256-25WC
Atmel Corporation
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Check for Price | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-XUUC-N28 | Not Qualified | 70 °C | 28 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | NO LEAD | UPPER | ATMEL CORP | DIE, | unknown | EAR99 | 8542.32.00.51 | DIE | 28 | |||||||||||||||||||||||||
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AT28C256-25FM/883-949
Microchip Technology Inc
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Check for Price | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 250 ns | EEPROM | AUTOMATIC WRITE | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-CDFP-F28 | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | DFP | RECTANGULAR | FLATPACK | YES | FLAT | 1.27 mm | DUAL | 3.02 mm | 18.285 mm | 10.16 mm | MICROCHIP TECHNOLOGY INC | FP-28 | compliant | 3A001.A.2.C | 8542.32.00.51 |