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AT52BR3224AT-70CJ
Atmel Corporation
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Check for Price | Yes | Yes | Transferred | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | SRAM IS ORGANISED AS 256K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B66 | Not Qualified | e1 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 66 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 10 mm | 8 mm | ATMEL CORP | BGA | TFBGA, | 66 | compliant | EAR99 | 8542.32.00.71 | |||||||
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AT52BR3224AT-70CI
Atmel Corporation
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | MEMORY CIRCUIT | SRAM IS ORGANISED AS 256K X 16 | FLASH+SRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 6 µA | 15 µA | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B66 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 66 | PLASTIC/EPOXY | TFBGA | BGA66,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 10 mm | 8 mm | ATMEL CORP | BGA | TFBGA, BGA66,8X12,32 | 66 | compliant | EAR99 | 8542.32.00.71 | |||||
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AT52BR3224A-70CJ
Atmel Corporation
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Check for Price | Yes | Yes | Transferred | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | SRAM IS ORGANISED AS 256K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B66 | Not Qualified | e1 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 66 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 10 mm | 8 mm | ATMEL CORP | BGA | TFBGA, | 66 | compliant | EAR99 | 8542.32.00.71 | |||||||
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AT52BR3224A-70CJ
Microchip Technology Inc
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | SRAM IS ORGANISED AS 256K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B66 | Not Qualified | e1 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 66 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 10 mm | 8 mm | MICROCHIP TECHNOLOGY INC | 10 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, CBGA-66 | compliant | EAR99 | 8542.32.00.71 | ||||||||||
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AT52BR3224A-70CI
Atmel Corporation
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Check for Price | No | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | 70 ns | MEMORY CIRCUIT | SRAM IS ORGANISED AS 256K X 16 | FLASH+SRAM | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 6 µA | 15 µA | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B66 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 66 | PLASTIC/EPOXY | TFBGA | BGA66,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 10 mm | 8 mm | ATMEL CORP | BGA | TFBGA, BGA66,8X12,32 | 66 | compliant | EAR99 | 8542.32.00.71 | |||||
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AT52BR3224AT-70CJ
Microchip Technology Inc
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | SRAM IS ORGANISED AS 256K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.3 V | 2.7 V | CMOS | INDUSTRIAL | R-PBGA-B66 | Not Qualified | e1 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 66 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 10 mm | 8 mm | MICROCHIP TECHNOLOGY INC | 10 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, CBGA-66 | compliant | EAR99 | 8542.32.00.71 |