Findchips: Parametric Search Results for Am27C128

Parametric results for: Am27C128 under EPROMs

Select parts from the table below to compare.

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Select Parts		Part Number

		AM27C128-305LCB AMD
		AM27C128-300DIB AMD
		AM27C128-200DC AMD
		AM27C128-90LEB AMD
		AM27C128-75LE AMD
		AM27C128-70LEB AMD
		AM27C128-120DEB AMD
		AM27C128-120DCB Rochester Electronics LLC
		AM27C128-70PC AMD
		AM27C128-125JC Rochester Electronics LLC

			Most Relevant					Technical															Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

300 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

300 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-GDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

200 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

25 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDIP-T28

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

WINDOWED, CERAMIC, DIP-28

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

90 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

120 µA

30 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Obsolete

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

70 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

25 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32(UNSPEC)

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32(UNSPEC)

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

120 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

120 µA

25 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP28,.6

unknown

3A001.A.2.C

8542.32.00.61

Check for Price

Contact Manufacturer

131.072 kbit

16KX8

5 V

120 ns

UVPROM

16000

16.384 k

ASYNCHRONOUS

PARALLEL

25 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDIP-T28

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

ROCHESTER ELECTRONICS LLC

DIP,

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

70 ns

OTP ROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

25 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

Check for Price

Contact Manufacturer

131.072 kbit

16KX8

5 V

120 ns

OTP ROM

16000

16.384 k

ASYNCHRONOUS

PARALLEL

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PQCC-J32

70 °C

PLASTIC/EPOXY

QCCJ

RECTANGULAR

CHIP CARRIER

YES

J BEND

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ROCHESTER ELECTRONICS LLC

QCCJ,

unknown

EAR99

8542.32.00.71

1 2 3 4 5 Next

Compare

AM27C128-305LCB

AMD

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

300 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

100 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-CQCC-N32

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

EAR99

8542.32.00.61

AM27C128-300DIB

AMD

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

300 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

5 V

100 µA

30 µA

5.5 V

4.5 V

CMOS

INDUSTRIAL

R-GDIP-T28

Not Qualified

85 °C

-40 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.588 mm

37.1475 mm

15.24 mm

ADVANCED MICRO DEVICES INC

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

AM27C128-200DC

AMD

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

200 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

25 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDIP-T28

Not Qualified

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

WINDOWED, CERAMIC, DIP-28

unknown

EAR99

8542.32.00.61

AM27C128-90LEB

AMD

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

90 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

120 µA

30 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32,.45X.55

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32,.45X.55

unknown

3A001.A.2.C

8542.32.00.61

AM27C128-75LE

AMD

Check for Price

Obsolete

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.71

AM27C128-70LEB

AMD

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

70 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

25 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CQCC-N32

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCN

LCC32(UNSPEC)

RECTANGULAR

CHIP CARRIER, WINDOW

YES

Tin/Lead (Sn/Pb)

NO LEAD

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ADVANCED MICRO DEVICES INC

QFJ

WQCCN, LCC32(UNSPEC)

unknown

3A001.A.2.C

8542.32.00.61

AM27C128-120DEB

AMD

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

120 ns

UVPROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

120 µA

25 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP28,.6

unknown

3A001.A.2.C

8542.32.00.61

AM27C128-120DCB

Rochester Electronics LLC

Check for Price

Contact Manufacturer

131.072 kbit

16KX8

5 V

120 ns

UVPROM

16000

16.384 k

ASYNCHRONOUS

PARALLEL

25 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-CDIP-T28

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

THROUGH-HOLE

DUAL

ROCHESTER ELECTRONICS LLC

DIP,

unknown

EAR99

8542.32.00.61

AM27C128-70PC

AMD

Check for Price

Obsolete

131.072 kbit

16KX8

5 V

70 ns

OTP ROM

COMMON

16000

16.384 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.75 V

100 µA

25 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

AM27C128-125JC

Rochester Electronics LLC

Check for Price

Contact Manufacturer

131.072 kbit

16KX8

5 V

120 ns

OTP ROM

16000

16.384 k

ASYNCHRONOUS

PARALLEL

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PQCC-J32

70 °C

PLASTIC/EPOXY

QCCJ

RECTANGULAR

CHIP CARRIER

YES

J BEND

1.27 mm

QUAD

3.556 mm

13.97 mm

11.43 mm

ROCHESTER ELECTRONICS LLC

QCCJ,

unknown

EAR99

8542.32.00.71

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