Parametric results for: Am27S43A under OTP ROMs
Filter Your Search
1 - 10 of 26 results
|
Select parts from the table below to compare.
Compare
Compare
|
AM27S43ALC
AMD
|
Check for Price | No | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 55 ns | OTP ROM | 1 | 2000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.5 V | 4.5 V | BIPOLAR | COMMERCIAL EXTENDED | R-CQCC-N32 | Not Qualified | e0 | 75 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.54 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | QCCN, LCC32,.45X.55 | 32 | unknown | EAR99 | 8542.32.00.71 | ||||
|
AM27S43A/BKA
AMD
|
Check for Price | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 80 ns | OTP ROM | 1 | 1000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.5 V | 4.5 V | BIPOLAR | MILITARY | R-GDFP-F24 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 24 | CERAMIC, GLASS-SEALED | DFP | FL24,.4 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | FLAT | 1.27 mm | DUAL | 2.286 mm | 15.367 mm | 9.525 mm | ADVANCED MICRO DEVICES INC | DFP | DFP, FL24,.4 | 24 | unknown | EAR99 | 8542.32.00.71 | |||
|
|
AM27S43A/BJA
Philips Semiconductors
|
Check for Price | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 55 ns | OTP ROM | 4000 | 4.096 k | TTL | MILITARY | R-XDIP-T24 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SIGNETICS CORP | DIP, DIP24,.6 | unknown | EAR99 | 8542.32.00.71 | |||||||||||||||
|
|
AM27S43ADMB
AMD
|
Check for Price | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 55 ns | OTP ROM | 1 | 2000 | 4.096 k | ASYNCHRONOUS | PARALLEL | 185 µA | 5.5 V | 4.5 V | TTL | MILITARY | R-XDIP-T24 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP, DIP24,.6 | compliant | EAR99 | 8542.32.00.71 | |||||||||
|
|
AM27S43A/BUC
AMD
|
Check for Price | No | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 25 ns | OTP ROM | 1 | 2000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.25 V | 4.75 V | BIPOLAR | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 2.54 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | QCCN, LCC32,.45X.55 | 32 | compliant | EAR99 | 8542.32.00.71 | ||
|
|
AM27S43ALMB
AMD
|
Check for Price | No | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 10 ns | OTP ROM | 1 | 2000 | 4.096 k | SYNCHRONOUS | PARALLEL | 185 µA | 5.5 V | 4.5 V | TTL | MILITARY | R-XQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class B (Modified) | 32 | CERAMIC | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | ADVANCED MICRO DEVICES INC | compliant | EAR99 | 8542.32.00.71 | ||||||||||
|
AM27S43ALCB-S
AMD
|
Check for Price | No | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 35 ns | OTP ROM | 1 | 2000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.25 V | 4.75 V | BIPOLAR | COMMERCIAL EXTENDED | S-CQCC-N28 | Not Qualified | e0 | 75 °C | 28 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC28,.45SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 1.905 mm | 11.43 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QLCC | QCCN, LCC28,.45SQ | 28 | unknown | EAR99 | 8542.32.00.71 | ||||
|
|
AM27S43A/BUA
AMD
|
Check for Price | No | Obsolete | 8.192 kbit | 8 | 1KX8 | 5 V | 80 ns | OTP ROM | 1 | 1000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.5 V | 4.5 V | BIPOLAR | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 2.54 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | QCCN, LCC32,.45X.55 | 32 | unknown | EAR99 | 8542.32.00.71 | |||
|
|
AM27S43ADM
AMD
|
Check for Price | No | Obsolete | 16.384 kbit | 8 | 2KX8 | 5 V | 55 ns | OTP ROM | 1 | 2000 | 4.096 k | SYNCHRONOUS | PARALLEL | 185 µA | 5.25 V | 4.75 V | TTL | MILITARY | R-XDIP-T24 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 Class C | 24 | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ADVANCED MICRO DEVICES INC | DIP, DIP24,.6 | unknown | EAR99 | 8542.32.00.71 | |||||||||
|
AM27S43A/BJA
AMD
|
Check for Price | No | No | Obsolete | 16.384 kbit | 4 | 4KX4 | 5 V | 55 ns | OTP ROM | 1 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 185 µA | 5.5 V | 4.5 V | BIPOLAR | MILITARY | R-GDIP-T24 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 24 | CERAMIC, GLASS-SEALED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 32.0675 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | DIP, DIP24,.6 | 24 | unknown | EAR99 | 8542.32.00.71 |