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CL10B104KB8NNNP
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | BULK | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 900 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | , 0603 | compliant | EAR99 | 8532.24.00.20 | ||||
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CL10B104KB8NNNO
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD, 10 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 900 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | , 0603 | compliant | EAR99 | 8532.24.00.20 | ||||
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CL10B104KB8NNNS
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED, 10 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | , 0603 | compliant | EAR99 | 8532.24.00.20 | ||||
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CL10B104KB8NNNB
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | BULK | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 900 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | , 0603 | compliant | EAR99 | 8532.24.00.20 | ||||
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CL10B104KB8NNNG
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | , 0603 | compliant | EAR99 | 8532.24.00.20 | ||||
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CL10B104KB8NNNC
Samsung Semiconductor
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Check for Price | Yes | Unknown | SAMSUNG SEMICONDUCTOR INC | compliant | SAMSUNG | |||||||||||||||||||||||||||||||
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CL10B104KB8NNND
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD PAPER, 13 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 900 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | CHIP | compliant | EAR99 | 8532.24.00.20 | 0603 | |||
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CL10B104KB8NNNF
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED, 13 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | , 0603 | compliant | EAR99 | 8532.24.00.20 | ||||
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CL10B104KB8NNNC
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD PAPER, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 900 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | CHIP | compliant | EAR99 | 8532.24.00.20 | 0603 | |||
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CL10B104KB8NNNE
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 100 nF | 50 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 900 µm | 1.6 mm | 800 µm | SAMSUNG ELECTRO-MECHANICS | , 0603 | compliant | EAR99 | 8532.24.00.20 |