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CL31B105KBHSNNE
Samsung Semiconductor
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Check for Price | Yes | Active | 1 µF | 50 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED PLASTIC, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | SAMSUNG SEMICONDUCTOR INC | , 1206 | compliant | EAR99 | 8532.24.00.20 | |||||
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CL31B105KBHSNNE
Samsung Electro-Mechanics
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Check for Price | Yes | Yes | Active | 1 µF | 50 V | 10 % | 1206 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, EMBOSSED PLASTIC, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1.6 mm | 3.2 mm | 1.6 mm | SAMSUNG ELECTRO-MECHANICS | CHIP | compliant | EAR99 | 8532.24.00.20 | 1206 | SAMSUNG |