Parametric results for: CS281 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 30 HIGH TEMP 12 STANDARD: UL 94V-0 40

260 hits Apply

1.9 inch 259

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0.085 inch 1 0.095 inch 46 0.12 inch 47 0.13 inch 47 0.165 inch 118

Min (inch) - Max (inch)

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1.9 inch 259

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19X19 259

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AU ON NI 31 GOLD OVER NICKEL 52 NOT APPLICABLE 2 SN-PB ON NI 26 TIN LEAD OVER NICKEL 52

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Gold (Au) - with Nickel (Ni) barrier 42 GOLD OVER NICKEL 85 TIN LEAD OVER NICKEL 82 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 50

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Contact Material (4)

BE-CU 57 BERYLLIUM COPPER 12 BERYLLIUM COPPER ALLOY 92 BRASS 2

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RND PIN-SKT 259

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IC SOCKET 259

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PGA281 239 PGA361 20

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GLASS FILLED EPOXY 2 GLASS FILLED THERMOPLASTIC 57 POLYBUTYLENE TEREPHTHALATE 80 POLYPHENYLENE SULFIDE 80 THERMOPLASTIC POLYESTER 40

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e0 132 e4 127

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Manufacturer (2)

Advanced Interconnections Corp 259 CommScope Inc 1

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0.1 inch 259

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STRAIGHT 259

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Number of Contacts (1)

281 259

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140.0 °C 47 150.0 °C 5 260.0 °C 42

Min (°C) - Max (°C)

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-60.0 °C 94

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RECTANGULAR 259

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100 µm 259

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Active 1 Obsolete 259

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No 3 Yes 1

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Terminal Pitch (1)

2.54 mm 259

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SOLDER 259

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