Parametric results for: CY7C1370DV25-200 under SRAMs

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Manufacturer Part Number: cy7c1370dv25200
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CY7C1370DV25-200AXC
Cypress Semiconductor
Check for Price Yes Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM 18 COMMON 1 1 512000 524.288 k SYNCHRONOUS 3-STATE YES PARALLEL 70 mA 300 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 40 100 PLASTIC/EPOXY LQFP TQFP100,.6X.9,26 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm CYPRESS SEMICONDUCTOR CORP QFP TQFP-100 100 compliant 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200BGC
Cypress Semiconductor
Check for Price No Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 2.38 V 300 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C NOT SPECIFIED NOT SPECIFIED 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm CYPRESS SEMICONDUCTOR CORP BGA 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200BGXI
Cypress Semiconductor
Check for Price Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 2.38 V 300 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e1 3 85 °C -40 °C 260 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm CYPRESS SEMICONDUCTOR CORP BGA 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119 119 compliant 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200BGI
Cypress Semiconductor
Check for Price No Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 2.38 V 300 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 85 °C -40 °C 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm CYPRESS SEMICONDUCTOR CORP BGA 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 119 compliant 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200AI
Cypress Semiconductor
Check for Price No Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns ZBT SRAM PIPELINED ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 2.625 V 2.375 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm CYPRESS SEMICONDUCTOR CORP QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200BZCT
Cypress Semiconductor
Check for Price No No Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 2.38 V 300 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B165 Not Qualified e0 3 70 °C 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 compliant 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200BGXC
Cypress Semiconductor
Check for Price Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 2.38 V 300 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e1 3 70 °C 260 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.4 mm 22 mm 14 mm CYPRESS SEMICONDUCTOR CORP BGA 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119 119 unknown 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200AXCT
Cypress Semiconductor
Check for Price Yes Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 2.38 V 300 µA 2.625 V 2.375 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e4 3 70 °C 260 40 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES NICKEL PALLADIUM GOLD GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm CYPRESS SEMICONDUCTOR CORP 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 compliant 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200BZXI
Cypress Semiconductor
Check for Price Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 2.38 V 300 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e1 3 85 °C -40 °C 260 20 165 PLASTIC/EPOXY LBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.4 mm 15 mm 13 mm CYPRESS SEMICONDUCTOR CORP BGA 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 165 unknown 3A991.B.2.A 8542.32.00.41
CY7C1370DV25-200AXI
Cypress Semiconductor
Check for Price Yes Obsolete 18.8744 Mbit 36 512KX36 2.5 V 3 ns 200 MHz ZBT SRAM PIPELINED ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 2.38 V 300 µA 2.625 V 2.375 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 40 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm CYPRESS SEMICONDUCTOR CORP QFP LQFP, QFP100,.63X.87 100 compliant 3A991.B.2.A 8542.32.00.41