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CY7C1470V33-167BZXI
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 75.4975 Mbit | 36 | 2MX36 | 3.3 V | 3.4 ns | ZBT SRAM | PIPELINED ARCHITECTURE | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | INDUSTRIAL | R-PBGA-B165 | COMMERCIAL | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | ROCHESTER ELECTRONICS LLC | BGA | 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | unknown | ||||||||||
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CY7C1470V33-167BZXI
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 75.4975 Mbit | 36 | 2MX36 | 3.3 V | 3.4 ns | 167 MHz | ZBT SRAM | PIPELINED ARCHITECTURE | COMMON | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | PARALLEL | 3.14 V | 3.6 V | 3.135 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 17 mm | 15 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | unknown | 3A991.B.2.A | 8542.32.00.41 |