Findchips: Parametric Search Results for CY7C2568XV18-600BZXC


Select Parts		Part Number

		CY7C2568XV18-600BZXC Infineon Technologies AG
		CY7C2568XV18-600BZXC Cypress Semiconductor

			Most Relevant						Technical																Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	Part Package Code	Pin Count	ECCN Code	HTS Code

Check for Price

Yes

End Of Life

37.7487 Mbit

2MX18

1.8 V

450 ps

600 MHz

DDR SRAM

PIPELINED ARCHITECTURE

COMMON

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

910 mA

1.7 V

910 µA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

260

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

INFINEON TECHNOLOGIES AG

13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

compliant

Check for Price

Yes

Transferred

37.7487 Mbit

2MX18

1.8 V

450 ps

600 MHz

DDR SRAM

PIPELINED ARCHITECTURE

COMMON

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

910 mA

1.7 V

910 µA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

260

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

compliant

BGA

165

3A991.B.2.A

8542.32.00.41

Compare

CY7C2568XV18-600BZXC

Infineon Technologies AG

Check for Price

Yes

End Of Life

37.7487 Mbit

2MX18

1.8 V

450 ps

600 MHz

DDR SRAM

PIPELINED ARCHITECTURE

COMMON

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

910 mA

1.7 V

910 µA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

260

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

INFINEON TECHNOLOGIES AG

13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

compliant

CY7C2568XV18-600BZXC

Cypress Semiconductor

Check for Price

Yes

Transferred

37.7487 Mbit

2MX18

1.8 V

450 ps

600 MHz

DDR SRAM

PIPELINED ARCHITECTURE

COMMON

2000000

2.0972 M

SYNCHRONOUS

3-STATE

PARALLEL

910 mA

1.7 V

910 µA

1.9 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

260

165

PLASTIC/EPOXY

LBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

compliant

BGA

165

3A991.B.2.A

8542.32.00.41

Parametric results for: CY7C2568XV18-600BZXC under SRAMs